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Multi-Scale Process TCAD at the Institute for Microelectronics, TU Wien

August 28 @ 15:00 - 16:00

Welcome to the Fall 2024 Semester. The first MIPSE seminar of the semester will be presented by Prof. Lado Filipovic of the Vienna University of Technology on Wednesday, August 28 at 3:00 pm in Room 1018 Dow. In his seminar, titled “Multi-Scale Process TCAD at the Institute for Microelectronics, TU Wien”, Dr. Filipovic will describe the outcome of plasma materials processing – the use of plasma generated fluxes to fabricate microelectronics devices. Dr. Filipovic’s team has developed world leading technology computer aided design (TCAD) tools that use plasma reactor scale inputs to predict evolution of nm feature scale structures that are utilized in process and circuit design. Please see attached flyer or (https://urldefense.com/v3/__https://mipse.umich.edu/seminars_2425.php__;!!HXCxUKc!3Ai-D-bGLNsLu8df7e-bXCybOPuytBOceibcp6LLK3zclxw6I0fFYIRBflDh4HVtgW7ne3ToiU-xQVxD$) for details.
The seminar will be conducted both in person and on Zoom.
Zoom meeting: (https://urldefense.com/v3/__https://umich.zoom.us/j/98163860657__;!!HXCxUKc!3Ai-D-bGLNsLu8df7e-bXCybOPuytBOceibcp6LLK3zclxw6I0fFYIRBflDh4HVtgW7ne3ToiTHz6_VE$), passcode: MIPSE
Speaker(s): Prof. Lado Filipovic,
Room: Room 1018 Dow, Ann Arbor, Michigan, United States, 48109, Virtual: https://events.vtools.ieee.org/m/431922