Come to solder a DIY Heart kit for valentines day. We will be providing kits for you to work on while also having fun with friends.Terre Haute, Indiana, United States

Come to solder a DIY Heart kit for valentines day. We will be providing kits for you to work on while also having fun with friends. Terre Haute, Indiana, United States

Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.Speaker(s): Dr. John H. Lau, Bldg: Birck Nano Technology Center, BRK 1001, 1205 W State St, West Lafayette, Indiana, United States, 47907, Virtual: https://events.vtools.ieee.org/m/407841

Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below. Speaker(s): Dr. John H. Lau, Bldg: Birck Nano Technology Center, BRK 1001, 1205 W State St, West Lafayette, Indiana, United States, 47907, Virtual: https://events.vtools.ieee.org/m/407841

IEEE PES Central Indiana Chapter is happy to host a technical seminar on power quality given by Mr. Larry Conrad on March 5 at AES Indaina's Morris Street Office.Speaker(s): , LarryAgenda: 4:50 - 5:00 pm: Arriving & taking the food5:00 - 5:50 pm: Lecture5:50 - 6:00 pm: Q&ARoom: Safety Room (1st floor), Bldg: AES Indiana Operation Center, 1230 West Morris Street, Indianapolis, Indiana, United States, 46221, Virtual: https://events.vtools.ieee.org/m/406760

Join us for our monthly executive committee meeting from 5 - 6:30 pm. This is a great opportunity to meet like minded people, learn leadership skills, and to help steer the direction of your local IEEE chapter. Who should attend: Executive committee for the Cedar Rapids Section, and any other leaders and interested members that wish to attend. Virtual: https://events.vtools.ieee.org/m/399837

The IEEE Toledo Section Executive Committee meets monthly to plan local events and discuss section operations. Section members are welcome to attend. Please contact a Section Officer for more information.1050 S Reynolds Rd, Toledo, Ohio, United States, 43615

The IEEE Toledo Section Executive Committee meets monthly to plan local events and discuss section operations. Section members are welcome to attend. Please contact a Section Officer for more information. 1050 S Reynolds Rd, Toledo, Ohio, United States, 43615

This free, online-only meeting is open to all IEEE membership grades, prospective members, and students!Please join us in our executive committee (ExCom) meeting where the IEEE Central Illinois Section discusses past and future activities, administrative items, and volunteer opportunities.Agenda: Call to OrderRoll CallReview Meeting MinutesReportsUnfinished BusinessNew BusinessAnnouncementsOpen FloorAdjournmentVirtual: https://events.vtools.ieee.org/m/408805

This free, online-only meeting is open to all IEEE membership grades, prospective members, and students! Please join us in our executive committee (ExCom) meeting where the IEEE Central Illinois Section discusses past and future activities, administrative items, and volunteer opportunities. Agenda: Call to Order Roll Call Review Meeting Minutes Reports Unfinished Business New Business Announcements Open Floor Adjournment Virtual: https://events.vtools.ieee.org/m/408805