Ongoing

CEE CREDIT fee FOR IEEE TC Sensors Chapter 2025 Event

Virtual: https://events.vtools.ieee.org/m/493913

Continuing Education credit registration fee of $7 to obtain the certificate. Virtual: https://events.vtools.ieee.org/m/493913

End of Semester IEEE Pizza Party

Room: 242, Bldg: Pioneer, 7400 Bay Rd, University Center, Michigan, United States, 48710

Social event. A thanks to students for attending meetings. This is our last meeting for the semester and calendar year. Wishing everyone good luck on exams. Co-sponsored by: SVSU ECE department Room: 242, Bldg: Pioneer, 7400 Bay Rd, University Center, Michigan, United States, 48710

IEEE Student Branch at UI Gaming Event

Room: G335, Bldg: IMU, 125 N Madison St, Iowa City, Iowa, United States, 52242

Join the IEEE Student Branch at UI to partake in some gaming! The event will have pizza provided and will be held in the Esports Arcade in the Iowa Memorial Union. This is a social event where you can meet other electrical/electronics/computer engineers and have some competitive fun! Room: G335, Bldg: IMU, 125 N Madison St, Iowa City, Iowa, United States, 52242

IEEE RAS Student Chapter Info Session

Room 26401 Senator Blvd, Southfield

Are you fascinated with making inanimate objects come to life? Do you want to learn how to improve human well-being by eliminating the dull, dirty, and dangerous? Or do you simply feel disconnected from the robotics community? To help you with these questions, Michigan Tech has a newly minted IEEE Robotics and Automation Society (RAS) student chapter! Before we get things rolling next semester, we want to make sure you know what to expect from the chapter. In an info session, we will talk more in depth about the organization and purpose of the chapter. Most importantly, we will discuss how you can help! We are looking for new members, activity ideas, and individuals to fill leadership positions. All undergraduate and graduate students are welcome! Room: 229, Bldg: EERC, 1400 Townsend Drive, Houghton , Michigan, United States

Advancing Fault Tolerance & Power Density in Modular Multilevel Converters via Innovative Circuit Design/Control Strategies

Virtual: https://events.vtools.ieee.org/m/518573

[]Modular Multilevel Converters (MMCs) are pivotal in high-voltage applications such as HVDC transmission, renewable energy integration, and medium-voltage motor drives due to their modularity and superior controllability compared to conventional power conversion topologies. However, the bulky and costly capacitors in conventional submodules (SMs) of MMCs pose significant challenges in terms of volume, weight, and efficiency, often accounting for more than 50% of the converter’s weight and 80% of its volume. In this talk, Dr. Jinia Roy will present a novel SM circuit incorporating the Active Power Decoupling (APD) technique to address these limitations through advanced control and circuit design. The proposed APD-SM architecture operates on the principle of redistributing ripple power—predominantly at the line and twice the line frequency—into a dedicated decoupling path. This circuit provides a parallel route for oscillatory current components, effectively offloading stress from the main capacitor and enabling a significant reduction in its size. The APD-SM enables up to a sevenfold reduction in capacitor size while maintaining voltage ripple within acceptable limits. Additionally, it inherently reduces fault current, circulating current, and allowing for a more compact arm inductor design. The presentation will delve into the theoretical foundations, impedance-based analysis, and control strategies that validate the effectiveness of the APD-SM. Co-sponsored by: Tanvi Nagarale Speaker(s): Jinia Roy, Agenda: 5:50 pm - Webex opens to all, informal/virtual networking, introductions 6:00 pm - Distinguished Lecture Talk begins 7:00 pm - End of talk, Begin Q&A 7:30 pm - Conclusion of event and formal vote of thanks to the speaker All times are EST/EDT Virtual: https://events.vtools.ieee.org/m/518573

December 2025 ExCom

Virtual: https://events.vtools.ieee.org/m/519328

December 2025 Ex-Com Meeting - Online Virtual: https://events.vtools.ieee.org/m/519328

MSOE Rockwell Automation Tour

1201 S 2nd St, Milwaukee, Wisconsin, United States, 53202

Come and tour Rockwell's High current lab, chemistry lab, shock and vibration, and clock tower. Food will be provided Co-sponsored by: Rockwell Automation 1201 S 2nd St, Milwaukee, Wisconsin, United States, 53202

MOVE USA Dec 2025 Tech Talk – Program Review and Join the MOVEment

Virtual: https://events.vtools.ieee.org/m/516500

Grayson Randall, Chair of the 2025 IEEE Humanitarian Technologies Board, will share an exciting update on the IEEE MOVE USA Program. His presentation will highlight the program’s evolution, its current operations, and the strategic direction shaping its future. Grayson will review past deployments—showcasing how MOVE volunteers have supported communities during disasters—along with key lessons learned and how new technologies are expanding MOVE’s capabilities. He will also provide an overview of the program structure, the wide range of volunteer roles available, and how YOU can become part of this impactful effort. Whether you’re interested in STEM outreach, emergency response, technical operations, amateur radio, logistics, training, or behind-the-scenes support, there is a place for you in the MOVEment. This session is designed to inform, inspire, and help you take the next step toward becoming a MOVE USA volunteer and making a real difference when communities need it most. Co-sponsored by: IEEE-USA MOVE Program Speaker(s): Grayson Randall Virtual: https://events.vtools.ieee.org/m/516500