2024 Real-Time Communications Conference Sponsorship Gold Sponsorship - 5000$ For more information on sponsor and exhibitor opportunities, please get in touch with Tom Costello at [email protected] or 847-890-5061 Co-sponsored by: IEEE REAL-TIME COMMUNICATIONS LAB Chicago, Illinois, United States
Abstract: While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures. [] Speaker(s): Dr. Mukta Farooq, Virtual: https://events.vtools.ieee.org/m/440607
IEEE Sensors Council Distinguished Lecture IEEE Chicago Section AP-MTT Joint Chapter Speaker(s): Pai-Yen Chen Room: LC C1, Bldg: Science and Engineering Offices (SEO) Building, 851 S Morgan St, Chicago, Illinois, United States, 60607
Generative Artificial Intelligence (AI) transforms how we live and work through numerous practical applications of intelligence, insights, and decision-making. These generative intelligence capabilities have expanded into industrial applications and systems, leading to many opportunities for innovation in research, development, practice, training, and education. For instance, in energy systems, Generative AI can inform decisions on renewables integration, energy conservation measures, energy optimization, and predictive maintenance. At the same time, across the board in robotics, it contributes to trajectory planning, state estimation, adaptive vision, and human interaction. In parallel to these rapid technical innovations, the risks of AI are also growing. AI that is poorly designed, developed, and evaluated without consideration of the broader socio-technical landscape of operation can result in system failures, service disruptions, security violations, and even human casualties. Some experts have also escalated this to a risk of extinction from AI that should be a global priority alongside other societal-scale risks such as pandemics and nuclear war. The seminar introduces Generative AI, its composition, capabilities, and distinction from conventional AI, followed by its opportunities and challenges in industrial domains. Risks and ethics of AI alongside globally accepted guidelines for responsible practice and development of AI will also be discussed. Co-sponsored by: Prof. Aleksander Malinowski Speaker(s): Dr. Daswin De Silva Agenda: 2:30 to 3:00 PM: Networking 3:00 to 4:00 PM: Seminar 4:00 to 4:15 PM: After-Event Socializing Room: 1150/1160, Bldg: Business and Engineering Convergence Center, Bradley University, 1500 W Main St, Peoria, Illinois, United States, 61615, Virtual: https://events.vtools.ieee.org/m/438667
Dinner with friends is the best way I could imagine celebrating the 75th Anniversary of the IEEE I&M Society, so I created a “date night’ event on November 1st, 2024. As celebrations go, it’s planned Minnesota low key, a reception with time to greet old friends and meet new ones. A 3-course dinner with wine, followed by a short recognition program and a distinguished lecturer presentation of interest to all. Our distinguished lecturer, Professor Yang Liu from the University of Iowa, will present, “Optical imaging, Computer Vision and Augmented Reality for Medical Applications”. Please add the evening to your calendar, sign up on line to register your choice of meal, and I look forward to seeing you November 1, 2024 at 5:00 pm. In the Plaza 3 room at the Doubletree by Hilton hotel, Bloomington, MN. The hotel is on the northwest corner of 494 and Highway 100 or 7800 Normandale Blvd, Minneapolis, MN 55439 to your GPS. Most of the cost of this event is covered by the IEEE I&M, but there is a maximum attendance of 50 and we will be required to meet catering minimums, so no shows will be painful. A nominal registration fee of $15 is being charged to discourage no shows. So please, check with your calendar manager, invite a guest, and register online. Current and Past I&M members are allowed to register and bring a guest. Please register your choice of entree as well. Speaker(s): Prof. Yang Liu, Agenda: 5:00 pm. Reception to greet friends 6:00 pm Dinner 6:45 pm 75th Anniversary Program 7:00 pm Distinguished Lecture by Prof. Yang Liu 7800 Normandale Blvd, Bloomington, Minnesota, United States, 55076
