Ongoing

IEEE CHICAGO 130TH ANNIVERSARY FAIR Sponsorship Webpage

Bldg: Kent School of Law, 565 W Adams, Illinois Institute of Technology, Chicago, Illinois, United States, 60661

Support the IEEE Chicago 130th Anniversary Fair by being a sponsor and selecting any of the following packages: - Silver Sponsor Level $400 - Company logo will be placed on the IEEE Chicago 130th Event website and the Program Booklet - Gold Sponsor Level $800 - Silver sponsorship level benefits plus the following - 10-minute presentation time slot at the event - Platinum Sponsor Level $1300 - Gold sponsorship level benefits plus the following - Table for company products and services (first come, first served) - Company name and logo on Friends of IEEE Chicago for 1 year - Post job openings in IEEE Chicago website for 1 year Bldg: Kent School of Law, 565 W Adams, Illinois Institute of Technology, Chicago, Illinois, United States, 60661

Call for Posters – Real Time Communications Conference & Expo at Illinois Tech

Bldg: Hermann Hall, 3241 S. Federal Street, Chicago, Illinois, United States, 60616

We invite students, research fellows and Industry practitioners to present their research results and/or projects in a poster session. Feel free to (mailto:?cc=&bcc=&subject=IEEE%20RTC%202024%20-%20Call%20for%20Posters!&body=IEEE%20Real%20Time%20Communications%20Conference%202024%20(RTC%20Conference)%20is%20pleased%20to%20host%20a%20poster%20presentation%20and%20best%20Poster%20Award.%0D%0A%0D%0AWe%20invite%20students,%20research%20fellows%20and%20Industry%20practitioners%20to%20present%20their%20research%20results%20and/or%20projects%20in%20a%20poster%20session.%0D%0A%0D%0APlease%20find%20the%20full%20submission%20guidelines%20at%20https://www.rtc-conference.com/2024/call-for-posters/)! Feel free to also share this call on your bulletin board or social media. For this you may use attached (https://www.rtc-conference.com/2024/wp-content/uploads/RTC-2024-Flyer-6.pdf) or (https://www.rtc-conference.com/2024/wp-content/uploads/RTC-2024-Flyer-7-1.png). How to submit a poster proposal To feature a Poster at the RTC Conference, please (https://forms.gle/CbdrB5eCkFayZSVn6) that includes the following information no later than 24th September 2024. - Title: A title for the poster. - Proposer: Include name, affiliation, and e-mail address. Correspondence related to the conference will be sent by e-mail. - Abstract: A description of the poster. Summarize the content of the poster in not more than 250 words. - Topic: Please make sure that your research aligns one of the following tracks at a broad level. - RTC Applications – multimedia apps and networks for example - AI/ML methods incorporated into RTC Applications and Services - Impact of Security and Privacy methods on RTC - Network Management and Resilience methods and their effect on RTC applications - For a more detailed list of potential topics of interest, please visit (https://www.rtc-conference.com/2024/research-track-cfp/#topics). This list is part of the conference’s call for papers, but we would like to see posters representing early results and in particular student work in these same areas. You will be notified by e-mail of the acceptance of the poster and we will let you know about the details of the time and place for the poster presentation. Once accepted, you will be required to print the poster yourself and bring it to the conference. Final poster guidelines - Poster dimensions – Not to exceed 30×40 inch - 300 dots per inch - Sample traditional poster template as a guide: (https://www.rtc-conference.com/2024/wp-content/uploads/authorlastname_firstname_RTC24Poster_V_1.pptx) and (https://www.rtc-conference.com/2024/wp-content/uploads/authorlastname_firstname_RTC24Poster_V_2.pptx) In addition to this, you need to also … - Submit as a single PDF version your poster. This will become part of the conference proceedings and will be posted to the conference website after the conference. - Named “authorlastname_firstname_RTC24Poster_V#.pdf” where poster # is the version number of the uploaded file (in case you decide to upload a later version, for example.) Agenda: [] Bldg: Hermann Hall, 3241 S. Federal Street, Chicago, Illinois, United States, 60616

2024 Real-Time Communications Conference Gold Sponsorship at IIT

Chicago, Illinois, United States

2024 Real-Time Communications Conference Sponsorship Gold Sponsorship - 5000$ For more information on sponsor and exhibitor opportunities, please get in touch with Tom Costello at [email protected] or 847-890-5061 Co-sponsored by: IEEE REAL-TIME COMMUNICATIONS LAB Chicago, Illinois, United States

In-Sensor AI Computing for Efficient Real-Time Machine Perception

Virtual: https://events.vtools.ieee.org/m/436745

Artificial intelligence (AI) and machine learning (ML) technologies have fueled many burgeoning applications from on-device learning to self-driving cars and collaborative robots. Despite these unprecedented advancements, the holy grail of enabling fully autonomous machine intelligence remains far from our grasp. One key challenge is the lack of performant and efficient hardware implementation, especially in the case of embedded/edge devices with rich sensory inputs yet stringent resource constraints. In this talk, I will present our work to tackle this challenge from a unique angle that leverages information processing ability innate in the analog/mixed-signal (AMS) domain by embedding AI computation directly inside the pixel circuits, delivering much-improved performance and efficiency. I will first introduce our design of in-sensor learned compressive acquisition (LeCA) and then talk about a novel in-sensor architecture that supports real-time gaze tracking, a key primitive in AR/VR applications. Finally, I will present CamJ, a first-of-its-kind energy modeling framework that empowers designers to navigate the large algorithm-hardware co-design space of computational image sensors. Biography: Dr. Xuan Zhang is an Associate Professor in the Electrical and Computer Engineering Department at Northeastern University. She works across the fields of integrated circuits/VLSI design, computer architecture, and electronic design automation. Dr. Zhang is an IEEE Women in Engineering (WiE) Distinguished Lecturer for 2023-2024, IEEE Circuits and Systems Society (CAS) Distinguished Lecturer for 2022-2023, and the recipient of NSF CAREER Award in 2020. She currently serves as the Associate Editor-in-Chief at IEEE Transactions on Circuits and Systems I (TCAS-I) and Associate Editor at IEEE Transactions on Computer-Aided Designs (TCAD). Her work has received numerous best paper awards and nominations including ISLPED Best Paper Award in 2022, AsianHOST Best Paper Award in 2020, DATE Best Paper Award in 2019, and nomination for Best Paper Awards at DAC 2022, ASP-DAC 2021, MLCAD 2020, DATE 2019, and DAC 2017. Co-sponsored by: IEEE Virtual: https://events.vtools.ieee.org/m/436745

Technical Presentation: In-Sensor AI Computing for Efficient Real-Time Machine Perception

Virtual: https://events.vtools.ieee.org/m/431983

Technical Presentation: In-Sensor AI Computing for Efficient Real-Time Machine Perception Artificial intelligence (AI) and machine learning (ML) technologies have fueled many burgeoning applications from on-device learning to self-driving cars and collaborative robots. Despite these unprecedented advancements, the holy grail of enabling fully autonomous machine intelligence remains far from our grasp. One key challenge is the lack of performant and efficient hardware implementation, especially in the case of embedded/edge devices with rich sensory inputs yet stringent resource constraints. In this talk, I will present our work to tackle this challenge from a unique angle that leverages information processing ability innate in the analog/mixed-signal (AMS) domain by embedding AI computation directly inside the pixel circuits, delivering much-improved performance and efficiency. I will first introduce our design of in-sensor learned compressive acquisition (LeCA) and then talk about a novel in-sensor architecture that supports real-time gaze tracking, a key primitive in AR/VR applications. Finally, I will present CamJ, a first-of-its-kind energy modeling framework that empowers designers to navigate the large algorithm-hardware co-design space of computational image sensors. Speaker(s): Silvia, Agenda: Technical Presentation: In-Sensor AI Computing for Efficient Real-Time Machine Perception Virtual: https://events.vtools.ieee.org/m/431983

PES Seminar: Ubiquitous Power Electronics in Modern Power Systems

Room: Safety Room (1st floor), Bldg: AES Indiana Operation Center, 1230 W Morris St, Indianapolis, Indiana, United States, 46221, Virtual: https://events.vtools.ieee.org/m/431920

Dr. Xiaonan Lu, an Associate Professor from Purdue University, West Lafayette, will give us a presentation on the latest modeling techniques and applications of power electronics in power systems. Free food and beverage will be provided to the in-person attendees, along with 1 PDH for those who needs continuing education hours. Abstract: Modern power electronic systems with enhanced observability and controllability serve as the backbone for bridging bulk power systems and individual customers. As reported by the U.S. Department of Energy (DOE), approximately 80% of the electricity used in the U.S. is expected to flow through power electronic equipment by 2030, which depicts the trend and the future of energy evolution driven by advanced power electronics. It is noteworthy that power electronics as versatile techniques provide solutions in various areas and applications, ranging from power generation and distribution in modern smart grids to intelligent electronics for end-users. This presentation will focus on the modeling, control, and real-world applications of grid-interactive power electronic inverters and how emerging modeling and control technologies could be utilized to advance the state-of-the-art of power electronics intensive power systems, emphasizing resiliency, stability, and sustainability enhancement in the areas of reconfigurable energy systems with dynamic microgrids, renewable energy integration through resilient power electronic interfaces, among others. Speaker(s): Xiaonan Agenda: 4:45 - 5:00 pm: Arrival & Refreshments 5:00 - 5:50 pm: Lecture 5:50 - 6:00 pm: Q&A Room: Safety Room (1st floor), Bldg: AES Indiana Operation Center, 1230 W Morris St, Indianapolis, Indiana, United States, 46221, Virtual: https://events.vtools.ieee.org/m/431920

Tour of CMD Corporation

Bldg: (Second building on the right), 3005 E. Pershing St., Appleton, Wisconsin, United States, 54911

3005 Pershing Street Appleton, WI 54911 CMD is a capital equipment manufacturer in the film converting and alternative energy markets. Built on a culture of integrity, we innovate unmatched profitable solutions for our customers and provide life-long service and support to the markets we serve. CMD develops plastic converting machines for manufacturing plastic bags, pouches and flexible packaging used in consumer goods and institutional products. Custom and stock machinery is available, as well as replacement parts, upgrade kits, engineering and technical services. CMD inventions include: high-speed, continuous-motion bag sealing and drawtape trash bag converting; embossed bag making; overlap bag winding for one-at-a-time dispensing of bags-on-a-roll; Intelligent Sealing for verifiable pouch quality; and high-performance RNG/CNG compression systems with units with walk-through enclosure designs. CMD employs 200+ dedicated professionals, and operates from a 126,000 sq. ft. campus located in Appleton, Wisconsin USA. Following the tour, we will gather for dinner at Good Company 110 N Richmond St. Appleton, WI 54912 Dinner cost is $20. There will be no charge for IEEE Student Members attending dinner. Agenda: 5:00 pm CDT Tour CMD Corp. After the tour - 6:30 pm CDT Social 7:00 pm CDT Dinner Good Company 110 N Richmond St. Appleton, WI 54912 Bldg: (Second building on the right), 3005 E. Pershing St., Appleton, Wisconsin, United States, 54911

IEEE Milwaukee Fall 2024 Exec Commitee Meeting

101 W Mitchell St, Milwaukee, Wisconsin, United States, 53204

Annual fall strategic planning, event overview, section group report meeting. Invite-only. 101 W Mitchell St, Milwaukee, Wisconsin, United States, 53204

IEEE Central Illinois Networking Event in Peoria

Bldg: Suite 24, The Fieldhouse Bar and Grill, 1200 W Main St, Peoria, Illinois, United States, 61606

You are invited to join us on Thursday, October 3rd, 2024, at the Fieldhouse Bar & Grill in Peoria, IL, for an informal networking meetup organized by the IEEE Central Illinois Section. This event is open to all IEEE member grades, including students and graduate students. REGISTER IF ATTENDING: Registration is complimentary. However, please note that all attendees are responsible for their own bills. Registration ends the morning of the event, or when all spaces have filled. BRINGING AN ADDITIONAL GUEST? If registering, please indicate if you plan to bring any guests. IEEE members may bring a nonmember guest. PARKING INFORMATION: - Nearest Lot: Parking spaces are available throughout the Campustown shopping center. This parking (like the event itself) is not on-campus. DRESS CODE: This event has no explicit dress code, however casual, semi-casual, and business casual seem common at the venue. ABOUT US: Formed as part of the American Institute of Electrical Engineers (AIEE) on June 28th, 1951; the IEEE Central Illinois Section serves members in Champaign, Springfield, Bloomington, Peoria, Quincy, Decatur, and their surrounding areas. Bldg: Suite 24, The Fieldhouse Bar and Grill, 1200 W Main St, Peoria, Illinois, United States, 61606