IEEE R4 Student Members,Looking for information on a possible career path?The IEEE Product Safety Engineering Society is having its international symposium in Chicago from April 30 to May 2nd, 2024. On may 1st, students are invited to attend the conference for free and attend informative sessions on the industry. See the attached flyer.This meeting will provide information on the society and the conference to students looking for information on the event. Please make some time to attend, and pass on to other students who may be interested.About PSES:The IEEE Product Safety Engineering Society focuses on the theory, design, development and practical implementation of product safety engineering methodologies and techniques for equipment and devices. This includes the study and application of analysis, techniques, construction topologies, testing methodologies, conformity assessments and hazard evaluations. The Society provides a focus for cooperative activities, including the promotion of product safety engineering for the benefit of humanity.This society targets design professionals and design engineers interested in electrical product safety. The IEEE Product Safety Engineering Society addresses safety engineering for equipment and devices used in the scientific, engineering, industrial, commercial and residential arenas. It allows engineers and other technical professionals an opportunity to discuss and disseminate technical information, to enhance professional skills, and to provide outreach to engineers, students and others with an interest in the field.Virtual: https://events.vtools.ieee.org/m/409843

Join us for the IEEE RRVS Seminar!Register online!For details please see: https://site.ieee.org/rrvsseminar/Speaker(s): see event flyer, Tebala Event Center, 7910 Newburg Rd,, Rockford, Illinois, United States, 61108

Join us for the IEEE RRVS Seminar! Register online! For details please see: https://site.ieee.org/rrvsseminar/ Speaker(s): see event flyer, Tebala Event Center, 7910 Newburg Rd,, Rockford, Illinois, United States, 61108

2024 RRVS IEEE EMC Seminar (https://site.ieee.org/rrvsseminar/) Virtual: https://events.vtools.ieee.org/m/413138

2024 RRVS IEEE EMC Seminar(https://site.ieee.org/rrvsseminar/)Virtual: https://events.vtools.ieee.org/m/413138

Abstract: 3D integration technology enables heterogeneous system scaling by offering higher I/O densities, shorter interconnect lengths, higher bandwidth and smaller form factors compared to 2D packaging solutions. In recent years, many products have been released taking advantage of this technology to combine logic, memory and imaging and/or optical components into 3D stacked die, or 2.5D interposer configurations. Due to the vertical integration of thinned silicon chips, the strong thermal coupling between the tiers in the 3D stack, and the difficulty to remove heat from within the 3D die stack, thermal management is one of the major challenges of 3D integration technology. The incorporation of 3DIC and co-packaged optics on 2.5D interposer architectures to boost the compute throughput, has further complicated the cooling challenge.In this talk, the thermal impact of the recent scaling trends in 3D die and wafer stacking and CPO, including hybrid bonding, backside power delivery, and BEOL scaling will be discussed. Furthermore, the thermal opportunities of 3D functional partitioning and advanced liquid cooling solutions, to enable 2.5D HPC applications of multiple kW, will be addressed.Speaker(s): Dr. Herman OprinsVirtual: https://events.vtools.ieee.org/m/411159

Abstract: 3D integration technology enables heterogeneous system scaling by offering higher I/O densities, shorter interconnect lengths, higher bandwidth and smaller form factors compared to 2D packaging solutions. In recent years, many products have been released taking advantage of this technology to combine logic, memory and imaging and/or optical components into 3D stacked die, or 2.5D interposer configurations. Due to the vertical integration of thinned silicon chips, the strong thermal coupling between the tiers in the 3D stack, and the difficulty to remove heat from within the 3D die stack, thermal management is one of the major challenges of 3D integration technology. The incorporation of 3DIC and co-packaged optics on 2.5D interposer architectures to boost the compute throughput, has further complicated the cooling challenge. In this talk, the thermal impact of the recent scaling trends in 3D die and wafer stacking and CPO, including hybrid bonding, backside power delivery, and BEOL scaling will be discussed. Furthermore, the thermal opportunities of 3D functional partitioning and advanced liquid cooling solutions, to enable 2.5D HPC applications of multiple kW, will be addressed. Speaker(s): Dr. Herman Oprins Virtual: https://events.vtools.ieee.org/m/411159

An in-person meeting of the West Michigan Section and Chapter/Affinity Group Executive Committees (ExComs) to discuss budgets, reports and events for 2024.If you enter the West side doors of the engineering building in the middle of the building, the conference room is in the Southeast corner of the building. It is easy to find if you just stay on the carpet.Sandwiches and chips and cups for water will be provided.Park in lots 4 and 5 on the West side of the building.Agenda: The agenda and minutes will be emailed to ExCom members prior to the meeting.Room: EB140, Bldg: Engineering Building, Calvin University, 1712 Knollcrest Circle SE, Grand Rapids, Michigan, United States, 49546--4403

An in-person meeting of the West Michigan Section and Chapter/Affinity Group Executive Committees (ExComs) to discuss budgets, reports and events for 2024. If you enter the West side doors of the engineering building in the middle of the building, the conference room is in the Southeast corner of the building. It is easy to find if you just stay on the carpet. Sandwiches and chips and cups for water will be provided. Park in lots 4 and 5 on the West side of the building. Agenda: The agenda and minutes will be emailed to ExCom members prior to the meeting. Room: EB140, Bldg: Engineering Building, Calvin University, 1712 Knollcrest Circle SE, Grand Rapids, Michigan, United States, 49546--4403

Though electrical incidents represent a relatively small percentage of all work-related incidents; they are disproportionately fatal. In the case of burn injury, it may result in extended hospitalization and rehabilitation. Proper protection is the key to reducing casualties during these incidents. IEEE 1584 and NFPA 70E are developed to protect the safety of the workers. For better understanding of the arc flash phenomena, the IEEE and the NFPA (National Fire Protection Association) have joined forces on an initiative to fund and support research and testing to improve the understanding of arc flashes. The results of this collaborative project will provide information that will be used to improve electrical safety standards, predict the hazards associated with arcing faults and accompanying arc blasts, and provide practical safeguards for employees in the workplace. The identified areas include but are not limited to 1) Heat and Thermal Effects, 2) Blast Pressure, 3) Sound, and 4) Light intensity. This presentation will cover the heat and thermal related arc flash hazards. It will include the basic understanding of the arc flash, performing the arcing current and incident energy estimation, and brief introduction to IEEE Std. 1584–2018, IEEE Guide for Performing Arc-Flash Hazard Calculations. Co-sponsored by: Van Wagner Speaker(s): Wei-Jen Lee, Agenda: To be posted Virtual: https://events.vtools.ieee.org/m/410210

Though electrical incidents represent a relatively small percentage of all work-related incidents; they are disproportionately fatal. In the case of burn injury, it may result in extended hospitalization and rehabilitation. Proper protection is the key to reducing casualties during these incidents. IEEE 1584 and NFPA 70E are developed to protect the safety of the workers.For better understanding of the arc flash phenomena, the IEEE and the NFPA (National Fire Protection Association) have joined forces on an initiative to fund and support research and testing to improve the understanding of arc flashes. The results of this collaborative project will provide information that will be used to improve electrical safety standards, predict the hazards associated with arcing faults and accompanying arc blasts, and provide practical safeguards for employees in the workplace. The identified areas include but are not limited to 1) Heat and Thermal Effects, 2) Blast Pressure, 3) Sound, and 4) Light intensity.This presentation will cover the heat and thermal related arc flash hazards. It will include the basic understanding of the arc flash, performing the arcing current and incident energy estimation, and brief introduction to IEEE Std. 1584–2018, IEEE Guide for Performing Arc-Flash Hazard Calculations.Co-sponsored by: Van WagnerSpeaker(s): Wei-Jen Lee, Agenda: To be postedVirtual: https://events.vtools.ieee.org/m/410210

This free, optional training event is available to all volunteers within the IEEE Central Illinois Section (CILS) and surrounding areas.This session will offer general tips and assistance for anyone needing to...- Run an IEEE Student Branch or Chapter- Create or organized events- Add/modify officers- Request email or web services- Report past and future meeting- Contact other IEEE members- Print/share flyers...and similar tasks.Agenda: Brief Introduction to the IEEE-CILSHow to use the IEEE WebsiteImportant IEEE web services and URLsUsing IEEE Collabratec to find events and volunteersVolunteer Tools (vTools)Q&AOpen FloorVirtual: https://events.vtools.ieee.org/m/410139

This free, optional training event is available to all volunteers within the IEEE Central Illinois Section (CILS) and surrounding areas. This session will offer general tips and assistance for anyone needing to... - Run an IEEE Student Branch or Chapter - Create or organize IEEE events - Add/modify officers - Request IEEE email or web services - Report past and future meeting - Contact other IEEE members - Print/share flyers ...or perform similar tasks. Agenda: Brief Introduction to the IEEE-CILS How to use the IEEE Website Important IEEE web services and URLs Using IEEE Collabratec to find events and volunteers Volunteer Tools (vTools) Q&A Open Floor Virtual: https://events.vtools.ieee.org/m/410139