• LTU Student Branch: ExCom Meeting

    Virtual: https://events.vtools.ieee.org/m/580536

    ExCom meeting Speaker(s): , Dr. Guduri Virtual: https://events.vtools.ieee.org/m/580536

  • Ch8: AdCom Teleconference

    Virtual: https://events.vtools.ieee.org/m/521678

    SEM Chapter 8 Officers AdCom meeting: Contact Scott Lytle: [email protected] for details and Teleconference phone information. Co-sponsored by: Scott Lytle Agenda: Agenda on-line: Contact Steve Tomba [email protected] for details. Virtual: https://events.vtools.ieee.org/m/521678

  • Quantum Functionality of Nanoscale-Controlled 2D Materials

    Room: RRB, Bldg: UIC Makerspace, 728 W Roosevelt Road, Chicago, Illinois, United States, 60607

    IEEE Chicago Quantum Computing Local Group members, IEEE Computer Society Chicago members and IEEE Chicago members are welcome to attend this quantum event organized by the UIC IEEE student branch. See below for details and registration. [] Co-sponsored by: IEEE UIC student branch Room: RRB, Bldg: UIC Makerspace, 728 W Roosevelt Road, Chicago, Illinois, United States, 60607

  • SEM Section ExCom Monthly Meeting (virtual) For OCTOBER 2026

    Virtual: https://events.vtools.ieee.org/m/525076

    The IEEE Southeastern Michigan Section Monthly ExCom (Executive Committee) Meeting (every 2nd Thursday of the month) same time 6:30 PM EST/EDT (This is a virtual meeting, unless stated otherwise). We will discuss Section mission objectives, guidance, direction, as well as all the chapter/affinity groups/student branches and section committee reports, events, plans, opportunities to assist each other and help create value for our members. All IEEE members are welcome to attend, but they do need to register in order to receive the webex details. NOTE: All Chapter/Affinity Groups/Student Branch Chairs are required to update and inform all attendees of their past/current activities and plans for the year. A standard template is provided - which every member can view. If the chairs cannot attend, they are required to nominate one of their current chapter/affinity group/student branch officers to attend on their behalf. https://drive.google.com/drive/folders/1mrCOzBVIofTLZ4Z5eovGza4VN6amLgz1?usp=sharing Co-sponsored by: Sharan Kalwani Speaker(s): Christopher Johnson, Sharan Kalwani, Agenda: Published on google drive - link sent each month via email to ALL the chapter/Affinity Group/Student Branch/Committee chairs. Ensure you are listed on the ExCom listserv as well (contact [email protected] in case of doubt) https://drive.google.com/drive/folders/1mrCOzBVIofTLZ4Z5eovGza4VN6amLgz1?usp=sharing Virtual: https://events.vtools.ieee.org/m/525076

  • ACM-IEEE WIE Twin Cities | Virtual Learning Series – Agent-to-Agent (A2A) communication

    Virtual: https://events.vtools.ieee.org/m/580592

    AI applications are rapidly evolving from standalone assistants into agentic systems that use tools, make decisions, and collaborate with other agents. As teams build agents on different frameworks and platforms, a new question emerges: how do these agents talk to each other without being tightly coupled to one specific implementation? In this introductory talk, Shravya Boini (Senior Engineer, Agentic Commerce) explores Agent-to-Agent (A2A) communication and why interoperability is becoming critical in the agentic AI ecosystem. We'll trace the evolution from single AI agents to multi-agent systems, the challenges of connecting agents across environments, and the core ideas behind A2A — agent discovery, capabilities, communication, and task collaboration — plus how A2A relates to MCP and traditional APIs. You'll leave with a practical understanding of why agent-to-agent interoperability matters, where A2A fits in the broader agentic AI landscape, and the key concepts to explore when designing multi-agent systems. Speaker: Shravya Boini, Senior Engineer – Agentic Commerce, Learn more about Shravya in (https://www.linkedin.com/in/shravyaboini/) 💻 Virtual — join link will be shared one day before the event 🌐 Open to practitioners everywhere Track: AI Agent Architecture & Implementation *** Run of show (60 min, internal) 6:00–6:05 — Welcome & housekeeping: quick note this is the pilot launch of the Virtual Learning Series, recording notice, how to use chat/Q&A 6:05–6:10 — Speaker introduction: Shravya's bio and talk framing 6:10–6:40 — Talk: From AI Agents to Agent Collaboration — Exploring A2A 6:40–6:55 — Live Q&A 6:55–7:00 — Wrap-up Virtual: https://events.vtools.ieee.org/m/580592

  • IEEE-MSN October ExCom

    Room: Fireside room, Bldg: Lakeview Library, 2845 N Sherman Ave, Madison, Wisconsin, United States, 53704, Virtual: https://events.vtools.ieee.org/m/576380

    Come join the Madison Executive Committee for the October meeting. This is a great opportunity to get more involved with the IEEE at a local level, learn new things, make friends, and influence our activities. We will start off with social time and food (provided by the IEEE) from 5:30pm to 6pm. The meeting will be from 6pm to about 7:45pm. If you are planning to eat, please register with in person attendance. If you have any dietary restrictions or a specific order, please indicate when you register. This month we will be meeting at the Lakeview Library in the back fireside room. Food is TBD. If you have a preference, let us know. There are some good places nearby. If you have suggestions for agenda items please reply or send an email send an email to [email protected] The event page will be updated with the finalized agenda before the meeting Agenda: Agenda 5:30 - 6:00 pm - Social time and food 6:00pm - 7:30pm - Meeting Link to Preliminary Agenda: (Will be added) Minutes from last meeting are here: (Will be added) Room: Fireside room, Bldg: Lakeview Library, 2845 N Sherman Ave, Madison, Wisconsin, United States, 53704, Virtual: https://events.vtools.ieee.org/m/576380

  • IEEE-MSN October ExCom

    Room: Fireplace side community room, Lakeview Public Library, 2845 N Sherman Ave, Madison, Wisconsin, United States, 53704, Virtual: https://events.vtools.ieee.org/m/580240

    Come join the Madison Executive Committee for the October meeting. This is a great opportunity to get more involved with the IEEE at a local level, learn new things, make friends, and influence our activities. We will start off with social time and food (provided by the IEEE) from 5:30pm to 6pm. The meeting will be from 6pm to about 7:45pm. If you are planning to eat, please register with in person attendance. If you have any dietary restrictions or a specific order, please indicate when you register. This month we will be meeting at the Lakeview Library, Fireplace Side Community Room. Food is TBD. If you have suggestions for agenda items please reply or send an email send an email to [email protected] Finalized agenda will be sent before the meeting. Agenda: Agenda 5:30 - 6:00 pm - Social time and food 6:00pm - 7:45pm - Meeting Link to Agenda: https://docs.google.com/presentation/d/1xvsya_AnHdSitHVMTV2L4Pa7hlr4H1WUF8Pi9jslEgE/edit?usp=drive_link Minutes from last meeting are here: https://docs.google.com/document/d/13z7YTs1ahhLQMXgHibxNLkpGRfa3Z2Lmpo1P5nt-Crw/edit?usp=drive_link Room: Fireplace side community room, Lakeview Public Library, 2845 N Sherman Ave, Madison, Wisconsin, United States, 53704, Virtual: https://events.vtools.ieee.org/m/580240

  • Multi-faceted talk on Engineering Licensure & Developing a HyperScale Facility

    Virtual: https://events.vtools.ieee.org/m/576567

    As part of the IEEE Day, this event covers more than 1 topic. To start off with: []Professional Licensure What does it take to get a Professional Engineering (PE) License in the State of Michigan and why that is that important to you? Followed by: []Developing a HyperScale Facility With the field of “Data Centers” expanding at what seems an ever-increasing rate due to this called “AI”, we have been asked to present what it takes to move from an enterprise data center to what is termed as a Hyperscaler data center. CTC Engineering is in the midst of three of these projects, specifically in the electrical power engineering aspect and this presentation is based on one of those projects that we have permission to shared. And why is this important to the Electrical Engineering class of 2026 - 2030? Without power, these projects don’t move past step 1!!! We will begin with the local level followed by a massive myriad of details leading up to construction documents. Time permitting we can entertain other items of interest Co-sponsored by: University of Michigan Ann Arbor - Student Branch Speaker(s): Glenn Keates, Michael Anthony Agenda: 1:00 - 1:10 PM - Sign in and welcome, introductions section, student branch, chapter business announcements 1:10 - 2:30 PM - Invited Speaker Lecture (in 2 parts) 2:30 - 3:00 PM – Q & A; networking All times are EST/EDT Virtual: https://events.vtools.ieee.org/m/576567

  • Agentic AI for Modern Computing

    Virtual: https://events.vtools.ieee.org/m/580877

    Abstract: Modern computing is often optimized in isolated layers, with separate tools for interfaces, software, and hardware. In this talk, we will start with expertise-driven design acceleration and expand to automated optimization. We show that large language model (LLM) agents can iteratively generate, test, and improve GPU kernels by reading hardware feedback, from single kernels to full end-to-end GPU programs. We then broaden the picture by showing how agents can more accurately ground interface elements and carry out computer interaction step by step, giving them the ability to operate real software, hardware environments, and applications. Bio: Caiwen Ding is an Associate Professor in the Department of Computer Science & Engineering at the University of Minnesota Twin Cities, which he joined in August 2024. He had been an Assistant Professor in the School of Computing at the University of Connecticut from 2019-2024. He received his Ph.D. from Northeastern University, Boston in 2019. His research interests span algorithm–system co-design for machine learning and artificial intelligence, privacy-preserving machine learning, machine learning for electronic design automation (EDA). Dr. Ding’s research has been published in leading venues across systems, architecture, and AI/ML—including DAC, ICCAD, ASPLOS, ISCA, MICRO, HPCA, SC, FPGA, MLSys, NeurIPS, ICML, CVPR, ACL, EMNLP, and IJCAI. He is a recipient of the NSF CAREER Award, Amazon Research Award, and Cisco Research Award. He has received multiple paper distinctions, including the Best Paper Award at the 2025 IEEE International Conference on LLM-Aided Design (ICLAD), the Best Paper Award at the 2023 AAAI DCAA workshop, Outstanding Student Paper at HPEC 2023, Best Paper Award Nominations at DATE 2018 and DATE 2021, and a publicity paper at DAC 2022. Speaker(s): Caiwen Ding, , Virtual: https://events.vtools.ieee.org/m/580877

  • Documentary Placeholder 2

    Virtual: https://events.vtools.ieee.org/m/575221

    As part of an innovative and fresh approach, i.e. a non-traditional meeting event: we will present a video documentary entitled: “XXXX" This is one of many documentaries/movies Documentary: XXXX Summary: AFTER the movie - we can have a brief discussion session. NOTE: You must supply your own soda pop and popcorn! :-) Trivia may also follow, so bring your Jeopardy hats too Co-sponsored by: Subramaniam Ganesan Agenda: 7:00 PM - Welcome and Introductions, Chapter business update; (on your own) Pizza, Popcorn and Soda Pop 7:15 PM - Documentary START 8:15 PM - End of Documentary; Start of Q & A; Group Discussion 8:30 PM - Wrap Up Virtual: https://events.vtools.ieee.org/m/575221

  • From Silicon to Intelligence: How AI Is Transforming the Semiconductor Lifecycle

    Chicago, Illinois, United States, Virtual: https://events.vtools.ieee.org/m/581434

    The semiconductor industry is rapidly evolving, and Artificial Intelligence is playing an important role across the entire semiconductor industry. Join the IEEE Chicago Section Young Professionals to discover how AI is transforming the semiconductor lifecycle, from chip design and manufacturing to testing and supply chain operations. Our guest speaker will share how AI, Machine Learning, Computer Vision, Predictive Analytics, GenAI, and Agentic AI supports process optimization, defect detection, predictive maintenance, yield improvement, demand forecasting, and supply chain optimization. We will discuss how AI can bring together data from different stages of the semiconductor lifecycle to improve efficiency, quality, reliability, and decision-making. Chicago, Illinois, United States, Virtual: https://events.vtools.ieee.org/m/581434

  • STEM Spark! 2026: Invent the Future

    2015 S Peoria St, Chicago, IL 60608, Chicago, Illinois, United States

    STEM Spark! is a dynamic half-day summit designed to ignite curiosity and inspire innovation among middle school students (grades 5–12). To be held on Saturday, October 10th, the event offers a vibrant mix of hands-on workshops, panel discussion, and interactive exhibits that highlight real-world applications of science, technology, engineering, and math. With carefully designed workshops, STEM Spark! aims to provide age-appropriate, engaging experiences that empower students to explore future STEM pathways and connect with mentors and professionals who are shaping the world through discovery and creativity. Agenda: Time Type Details 8:30 – 9:00 AM Welcome Check-in & Welcome Activities Students arrive, check in, and receive color-coded name tags by grade group. Icebreaker STEM trivia and tabletop challenges. 9:00 – 9:45 AM Panel Panel Discussion A panel of college students or young STEM professionals sharing personal journeys. Focus on early challenges, building confidence, and the value of curiosity. 9:45 – 10:30 AM Workshop Workshop Block 1 Students split into grade-appropriate workshops (see breakdown below). Middle School Workshop A: - Anya Allen Middle School Workshop B: - Sasidhar Tadanki High School Workshop C: - Spandana Koradonbi High School Workshop D: - Mike Anderson 10:30 – 10:45 AM Break Break & Exhibits Snacks provided. Demo stations with hands-on exhibits (e.g., robotics, VR, science demos). Exhibits dependent on sponsor support. 10:45 – 11:30 AM Workshop Workshop Block 2 Students split into grade-appropriate workshops (see breakdown below). Middle School Workshop B: - Sasidhar Tadanki Middle School Workshop A: - Anya Allen High School Workshop D: - Mike Anderson High School Workshop C: - Spandana Koradonbi 11:30 – 11:45 PM Break Break & Exhibits Snacks provided. Demo stations with hands-on exhibits (e.g., robotics, VR, science demos). Exhibits dependent on sponsor support. 11:45 – 12:00 PM Closing Wrap-Up & Prize Raffle Quick wrap-up, recognition of volunteers and sponsors, prize drawing. Students complete short feedback cards. 2015 S Peoria St, Chicago, IL 60608, Chicago, Illinois, United States