Why are Semiconductor Packaging & Heterogeneous Integration taking Center Stage for continuing Moore’s Law?

Abstract:

Heterogeneous Integration (HI) provides the opportunity for dense connectivity between smaller dies from advanced technology nodes to improve yield, provides for connectivity between optimized legacy technology nodes to reduce time to market, and enables the connectivity of dissimilar dies on a single platform to enhance functionality. Though fueled by semiconductor packaging, HI represents higher levels of integration than what the semiconductor industry is used to and has done in the past. This is paramount to continuing Moore’s law and making More than Moore possible.

As expected, this approach will pose many challenges but lots of opportunities as HI takes center stage. This presentation will cover the current state of the art, emerging applications, challenges that need to be addressed, and solutions being pursued.

Speaker(s): Prof. Madhavan Swaminathan,

Virtual: https://events.vtools.ieee.org/m/413848