Step-by-Step Manufacturing of Multi-layer Printed Circuit Boards (PCB)

Mass manufacture of printed circuit boards (PCBs) on an industrial scale is achieved using complex high precision production lines and machines. Visiting/touring a large, industrial sized PCB manufacturing plant with automated equipment can seem mysterious and often leads to more confusion within the steps and how to relate within the overall process. Worldwide, engineering and technician educational programs often fail to introduce printed circuit board manufacturing within dedicated programs. The resulting lack of knowledge of this process is detrimental to practicing engineers, designers, and technicians who find themselves called upon to act as either dedicated PCB layout engineers or other PCB related roles in this ever-growing field. Effective PCB design and manufacturing require precise and detailed, hands-on knowledge of the overall process, so that PCB designs can be successfully translated into layout and subsequent production by a PCB shop. This presentation will break down the multi-faceted PCB fabrication process into discrete, more clearly delineated micro-processes and methods that can be more easily visualized and understood. Starting from bare laminate and working all the way up to final finish, discussion topics will include photoimaging, drilling, plating, etching, lamination, stack up, and plating.
This presentation will count for 1 Professional Development Hour (PDH) for the PE License in Wisconsin and Michigan.
Speaker(s): Dr. Chris Middlebrook
Agenda:
5:00 Featured Speaker – Dr. Chris Middlebrook
D.J. Bordini Center at FVTC
6:30 Adjourn to Cheddar's Scratch Kitchen
4531 W Wisconsin Ave
Appleton, WI
6:45 Social time, cash bar open
Order meals from the restaurant menu
7:00 Section announcements, door prize drawing
Room: BC141, Bldg: D.J. Bordini Center at FVTC, 5 N. Systems Drive, Appleton, Wisconsin, United States, 54914