Upcoming Meetings and Webinars Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection -- WLP, 3D, inline inspection, buried layers, high resolution, tomography, multi-chiplet, submicron defects ...
(on the Internet)
Join our IEEE ListServ Dlist! Check back here for new upcoming events! Workshops and Conferences: |
Let us hear from you!
Slides and Webinars from Past Meetings Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling -- heterogeneous integration, 3D, multi-chip stacks, high-density interconnects, cooling ...
At Purdue University (and on the Internet)
Thermal Challenges and Advanced Cooling Opportunities for 2.5D and 3D High Performance Computing -- heterogeneous system scaling, logic+memory+optical, backside power, thermal design, advanced cooling ...
Birck Nanotechnology Center, West Lafayette (and online via Zoom)
Co-Packaged Optics: Heterogeneous Integration of Photonic ICs and Electronic ICs -- vs SiPhotonics, photonic ICs, optical transceiver, form factors, performance, bridge vs interposer, billion-transistors, AI engines, glass substrates ...
(In person, and on the Internet)
Heterogeneous Integration Innovations Enabled by Glass-Core Packaging and 3D Technologies -- high-density packaging, die integration, connectivity, 3D, glass-core, panel array, mm-wave, digital ...
(on the Internet)
Advanced Power Electronics and Electric Machines for Electric-Drive Mobility Applications -- traction drives, thermal management, single-phase liquid, dielectric fluids, modeling and characterization ...
(on the Internet)
Interconnect Reliability in Advanced Packaging and Heterogeneous Integration -- high density, performance, failure modes, current density, accelerated testing, analysis ...
Birck Nanotechnology Center, West Lafayette (and WebEx)
|
We are in the process of organizing talks — both in-person and via the Internet — for the fall and winter. Please let us know about potential speakers. Contact one of our officers, on the About Us page.