IEEE CIS-EPS Chapter

Upcoming Meetings and Webinars

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Workshops and Conferences:

Slides and Webinars from Past Meetings

Heterogeneous Integration Innovations Enabled by Glass-Core Packaging and 3D Technologies -- high-density packaging, die integration, connectivity, 3D, glass-core, panel array, mm-wave, digital ...
Scheduled
(on the Internet)
Advanced Power Electronics and Electric Machines for Electric-Drive Mobility Applications -- traction drives, thermal management, single-phase liquid, dielectric fluids, modeling and characterization ...
Scheduled
(on the Internet)
Interconnect Reliability in Advanced Packaging and Heterogeneous Integration -- high density, performance, failure modes, current density, accelerated testing, analysis ...
Scheduled
Birck Nanotechnology Center, West Lafayette (and WebEx)
Introduction to Digital Cameras: Technology, Packaging, Challenges -- computer-vision, detection, system design, module hardware, packaging ...
Scheduled
Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size -- fine pitch, interconnect density, face-to-face connection, signal integrity, low power ...
Scheduled
Using Glass Carriers for Precision Wafer Thinning and Warpage Control -- glass attributes, properties, ultra-thinning, variation, tuned CTE, silicon-matched, applications ...
Scheduled

We are in the process of organizing talks — both in-person and via the Internet — for the fall and winter. Please let us know about potential speakers. Contact one of our officers, on the About Us page.