Speaker: Dr. Mukta Farooq, 3D Heterogeneous Integration Team Leader, IBM Research
Meeting Date: Friday, 1st November, 2024
Time: Virtual at 12:00 noon Eastern
Location: Please see the registration page for the zoom link
Cost: none
Reservations: https://events.vtools.ieee.org/m/440607

Abstract While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures.

Bio: Dr. Mukta Farooq is a metallurgist and materials scientist with expertise in Heterogeneous Integration for Chiplet Technology, CMOS BEOL, Lead-free Alloys, and Chip Package Interaction. She has 244 granted US patents, 66 granted international patents, and is an IBM Lifetime Master Inventor and IBM Academy of Technology member. She has been invited to give keynote talks and teach short courses, and to write papers in her field of expertise. Dr. Farooq received her BS from IIT-Bombay, MS from Northwestern University, and PhD from Rensselaer Polytechnic Institute.