Conference Dates: May 27-30, 2025     — Gaylord Texan Resort, Dallas TX USA   (more)
Call for Papers — Abstracts due September 16, 2024

Summary:You are invited to submit an abstract for the the 24th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2025). ITherm 2025 will be co-located with the 75th Electronic Components and Technology Conference (ECTC 2025). Sessions in the areas of component and system level thermal management, mechanics and reliability, emerging technologies and fundamentals will all be on the program.
Abstracts are now being accepted!
Information, and Call for Papers: www.ieee-itherm.net