Hosted by the Central Indiana Electronics Packaging Chapter
Call for Presentations (Please submit by August 15th)

Meeting Date: November 7-8, 2024
Location: Both in-person (at Purdue University) and online (via WebEx)
Registration includes access to On-Demand videos of most presentations (2 weeks after Symposium)
Information and Registration: attend.ieee.org/repp
Summary: This major IEEE-EPS symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.