Conference Dates: May 28-31, 2024
Summary:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Registration is now open! Review the Advance Program
Information: www.ectc.net

Topical Areas:
• Applied Reliability
• Assembly & Manufacturing Technology
• Emerging Technologies
• RF, High-Speed Components & Systems
• Interconnections
• Materials & Processing
• Packaging Technologies
• Photonics
• Thermal/Mechanical Simulation & Characterization
• Interactive Presentations