Conference Dates: May 28-31, 2024
Summary:You are invited to attend the 23rd Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2024), which will be held at the Gaylord Rockies Resort & Convention Center in Denver, Colorado, USA, from May 28 to May 31, 2024. ITherm 2024 will be co-located with the 74th Electronic Components and Technology Conference (ECTC 2024). Sessions in the areas of component and system level thermal management, mechanics and reliability, emerging technologies and fundamentals are on the program.
Registration is now open!
Information: www.ieee-itherm.net