Conference Dates: December 5-8, 2023
Summary: EPTC is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G/6G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.

Keynote Presentations:   &nbsp: — “Advanced System Integration Technology Trend”, Dr Douglas Yu, Vice President of R&D, Taiwan Semiconductor Manufacturing Corporation (TSMC);   &nbsp: — “2.5D/3D Heterogeneous Integration for Silicon Photonics Engines”, Dr. Radha Nagarajan, Senior Vice President, and Chief Technology Officer, Marvell’s Optical and Copper Connectivity Group;   &nbsp: — “Advanced Packages Enriching Heterogeneous Integration”, Dr. C.P. Hung, Vice President, Corporate R&D, ASE Group;   &nbsp: — “Will Advanced Packaging Save Moore’s Law?”, Yang Pan, Corporate Vice President, Lam Research;   &nbsp: — “Challenges in the Analysis and Testing of Advanced Packaging Systems”, Dr. Mo Shakouri, President & CEO of Microsanj LLC, USA.

Information and full program: www.eptc-ieee.net