Thermal challenges and advanced cooling opportunities for 2.5D and 3D high performance computing

Abstract: 3D integration technology enables heterogeneous system scaling by offering higher I/O densities, shorter interconnect lengths, higher bandwidth and smaller form factors compared to 2D packaging solutions. In recent years, many products have been released taking advantage of this technology to combine logic, memory and imaging and/or optical components into 3D stacked die, or 2.5D interposer configurations. Due to the vertical integration of thinned silicon chips, the strong thermal coupling between the tiers in the 3D stack, and the difficulty to remove heat from within the 3D die stack, thermal management is one of the major challenges of 3D integration technology. The incorporation of 3DIC and co-packaged optics on 2.5D interposer architectures to boost the compute throughput, has further complicated the cooling challenge.

In this talk, the thermal impact of the recent scaling trends in 3D die and wafer stacking and CPO, including hybrid bonding, backside power delivery, and BEOL scaling will be discussed. Furthermore, the thermal opportunities of 3D functional partitioning and advanced liquid cooling solutions, to enable 2.5D HPC applications of multiple kW, will be addressed.

Speaker(s): Dr. Herman Oprins

Virtual: https://events.vtools.ieee.org/m/411159