Brandon Schenck of Marvell will be giving a talk regarding AI and its impacts on design and advanced packaging.
Brandon Schenck – Senior Principal Engineer, Marvell Custom Compute and Storage.
I've been a custom design and ASIC engineer for 20 years, starting my career as a clock logic and physical design engineer at IBM as a co-op in 1999. After 4 additional internships, I finally started full time in 2004 and worked at IBM until its microelectronics divestiture to GlobalFoundries in 2015. When GlobalFoundries refocused their attention from leading-edge nodes to specialized processes in 2018, our ASIC design services team divested (again) to Avera Semi, which was ultimately acquired by Marvell in 2019, where I remain today. In the course of my career, I've participated in and led design teams for leading industry customers like Microsoft, Google, Cisco, and Meta. Today I am part of the technical leadership for a number of major client AI inference and network chip designs.
Agenda:
6:30 – 7:00 Social half hour to grab food and drink
7:00 – 8:00 Technical talk
Room: Mann Hall, Bldg: Medical Sciences Building, 300 3rd Ave SW, Rochester, Minnesota, United States, 55902, Virtual: https://events.vtools.ieee.org/m/461941