Events

Quantum will influence infrastructure, energy use, workforce development, and public trust. That makes it a civic question — not just a scientific one. This Middle Ground session convenes the people shaping quantum’s trajectory and the communities it will shape, because we are all stakeholders in the outcome. ​Quantum and the Common Good Tuesday, March 31 @ mHUB ​Quantum is moving from research to infrastructure. ​This Middle Ground session convenes founders, engineers, manufacturers, investors, policymakers, community voices, environmental leaders, and journalists for a practical conversation about what it will take for Chicago to build — and sustain — a real quantum economy. ​Hosted at mHUB, with participation from leaders like Nick Farina Jr. (EeroQ) and members of the local IEEE quantum community. ​No hype. Just clarity. ​What must exist for quantum companies to build, scale, and stay here? Where are the gaps? And how do we ensure this growth benefits the broader Chicago ecosystem? ​All stakeholders in the room. Details of the event at: https://themiddleground.netlify.app/#tickets IEEE Chicago members are welcome to attend this event and register for 50% off regular ticketed price with code IEEECHI. Bldg: mHub, 1623 W Fulton St, Chicago, Illinois, United States

Join us for our 3rd Career Workshop with Daniel Helo Puccini and learn how to refine your elevator pitch and present yourself confidently in professional settings. A collaboration between IEEE and MSU Claude Builder Club 📍 Anthony Hall 1255 🗓 March 31 @ 6:30 PM Bldg: Anthony Hall, 474 S Shaw Ln, East Lansing, Michigan, United States, 48824

John Dungan brings more than 35 years of non-profit leadership and a deep commitment to helping people through their most difficult moments. As the Community Disaster Program Specialist for the Central and Northern Missouri Chapter of the American Red Cross since 2017, he has recruited, trained, and supported volunteers who have helped thousands of families recover from disasters such as home fires, tornadoes, and floods. In this session, John will share how you can make a meaningful impact in your community—without deploying to large-scale disasters—by volunteering locally with the American Red Cross. While the organization responds to over 60,000 disasters annually, most are neighborhood emergencies that depend on volunteers, who make up more than 90% of the workforce. Participants will explore a range of opportunities, including direct support for families, disaster coordination, logistics, technology roles, and flexible remote options. Whether you prefer hands-on engagement or behind-the-scenes support, you’ll learn how to use your skills to make a lasting difference and help build stronger, more prepared communities. Co-sponsored by: IEEE-USA MOVE Program Speaker(s): John Dungan Virtual: https://events.vtools.ieee.org/m/550725

This free, online-only meeting is open to all IEEE membership grades, prospective members, and students! Please join us in our executive committee (ExCom) meeting where the IEEE Central Illinois Section discusses past and future activities, administrative items, and volunteer opportunities. Agenda: Call to Order Roll Call Review Meeting Minutes Reports Unfinished Business New Business Announcements Open Floor Adjournment Virtual: https://events.vtools.ieee.org/m/552085

The Agriculture, Manufacturing, and Engineering Technology (AMET) Division at Fox Valley Technical College features extensive, industry‑grade laboratory facilities that support applied learning across manufacturing and engineering technology programs. Purpose‑built labs in automation, robotics, CNC machining, industrial controls, and engineering technologies mirror real-world manufacturing environments and allow students to work hands‑on with modern equipment and systems. This IEEE Northeastern Wisconsin Section tour will highlight these state‑of‑the‑art labs and demonstrate how AMET integrates practical, laboratory‑based instruction with engineering concepts to prepare a highly skilled technical workforce for the region’s advanced manufacturing industries. We will begin the tour at the D.J. Bordini Center with a welcome and introduction session with the Dean of the Division, followed by tours of various division labs and programs. Agenda: 5:00 pm CDT Tour of AMET Division at Fox Valley Technical College D.J. Bordini Center at FVTC After the tour- 6:30 pm CDT Social-Happy Hour at Cheddar's Scratch Kitchen - Cash Bar 4531 W Wisconsin Ave Appleton, WI 6:45 pm CDT Dinner at Cheddar's Scratch Kitchen Cost: $20, payable at registration 7:00 pm CDT Short business meeting Door prize drawing Room: BC112B, Bldg: D.J. Bordini Center at FVTC, 5 N. Systems Drive, Appleton, Wisconsin, United States, 54914

MSU IEEE presents: Research Presentation Night 🔬 Join us for an evening with well-known professors sharing their research and insights—perfect for anyone interested in learning more about cutting-edge work in engineering. 🗓 Thursday, April 2nd @ 6 PM 📍 Engineering Building, Room 2400 Free food provided! Hope to see you there! Room: 2400, Bldg: Engineering Building, 428 S Shaw Ln , East Lansing, Michigan, United States, 48824

Hosted by: ACM Chicago and UIC Information and Decision Science Department The way we build software has changed forever—but some fundamentals remain essential. Core foundations of software engineering—abstraction, collaboration, correctness, and composition—still matter. IntentC is an exploration of what a mature software engineering project might look like in the future. The talk will examine how software projects should be defined, built, and evolved, drawing on both experimental ideas and real-world industry experience. The session will include: - Prepared materials and live demos - Insights from a senior industry leader at Indeed - Thoughtful discussion on the future of software engineering - Ample time for questions and community conversation This event is especially relevant for students interested in software engineering, computer science, data science, systems design, research, and tech careers in industry. Co-sponsored by: UIC IDS, ACM Chicago, IEEE UIC student branch, ACM UIC student chapter Agenda: 5:30 - 6:00 PM Networking in-person 6:00 - 6:05 PM Introductions 6:05 - 6:45 PM Talk 6:45 - 6:55 PM Q&A 6:55 - 7:00 PM Conclusion and Adjournment 7:00 - 7:30 PM Networking in-person Room: 605, Bldg: UIC Student Center East, 750 South Halsted St, Chicago, Illinois, United States, Virtual: https://events.vtools.ieee.org/m/550708

Combined Computational and Experimental Investigation of Artificial Heart/Lung and Brain Biomechanics Dr. Ge He Department of Biomedical Engineering Lawrence Technological University Abstract In this talk, I will present my previous and current research on artificial heart/lung devices and brain biomechanics. First, I will discuss blood-contacting medical devices such as artificial hearts and lungs, which provide cardiopulmonary support for patients with heart or lung failure. I will describe how I developed and applied mathematical models integrated with computational fluid dynamics (CFD) to guide the design and optimization of these devices. Prototypes generated through this simulation-based approach were evaluated using in vitro blood loop testing and demonstrated superior hemolytic performance compared to existing commercial devices. Next, I will highlight our integrative approach to studying brain biomechanics across multiple length scales by combining mechanical testing, biomedical imaging, and theoretical modeling. Our model captures complex brain tissue mechanical behaviors—such as loading rate sensitivity, fiber orientation dependence and damage accumulation—and has been incorporated into a full-scale human head model to visualize fiber tract damage under head impact conditions. Finally, I will discuss ongoing efforts to extend the model to account for tissue-fluid interactions, enabling a more comprehensive understanding of brain mechanics in in both healthy and diseased states. Date: April 3, 2026 Time: 1:00 – 2:00PM Venue: E101, Engineering Building Speaker(s): Dr. He, Room: E101, Bldg: College of Engineering, Lawrence Technological University, 21000 West Ten Mile Road, Southfield, MI, 48075-1058, Southfield, Michigan, United States, 48075

QC Elite Team 648 Robotics ( www.qcelite.com ) competes annually to inspire its Quad Cities high school participants to be future engineers and scientists. Each January, teams across the country receive a robot kit, and must design and build a robot over the next two months to compete against robots from other teams in the region, leading to the international competition. Each year’s contest is new, requiring distinctive robot behaviors. QC Elite is nearing completion of its 2026 season. The team will display and explain the mechanical, electrical, and programming features of this year’s robot that distinguish it from past competitions, and will also demonstrate the behavior of a working robot from a previous competition. The tour and lunch will be held at their maker space on the north side of Southpark Mall across from the Riverbend Food Bank and near VonMaur - "QC STEM Alliance". We will order pizza for lunch for the Section members, SAU Student Branch and for the Flaming Squirrels. Agenda: 11:00-Noon Arrival and informal observation of team building activity Noon-12:30 Lunch - Assorted Pizza, Soft Drinks, Chips, Cookies 12:30-1:00 Brief presentation on this year’s design and build 4500 16th St, Moline, Illinois, United States, 61265

Bi-weekly administrative meeting for Vehicular Technology Society chapter (VT06) in Southeastern Michigan Section. Our OU # is CH04051. We invite all members of the VTS locally to participate and provide their input. Co-sponsored by: [email protected] Agenda: 09:00 PM - Meeting opens 0905 PM - Updates on topics from last meeting 0915 PM - New items from the attendess 0920PM - Wrap up and sharing notes 0930PM - Meeting ends ALL times are local EDT/EST! Virtual: https://events.vtools.ieee.org/m/551945

April 2026 Ex-Com Meeting Online Agenda: A. Call to Order B. Officer Reports a. Secretary - Shayne Brown b. Treasurer -Ryan Goolsby c. Vice Chair - Ed McConnell d. Chair - Jarrad Henson C. New Business a. IEEE Principles of Business Conduct/Conflict of Interest D. Old Business a. Student Awards b. IEEE Nexus R4 competition E. Chapter/Affinity Group Updates a. IAS - Jarrad Henson b. Computer/Controls c. Power - Bob Toth d. Young Professionals - Nathan Ahrens e. WIE - Jessica Bollin-Smith Committee Updates a. Membership Development - Jian-Yu Lu b. PACE - Tom Papademos c. Student Activities - Raghav Khanna d. Webmaster - Bill Hoyt e. Technical Programs - Steve Root i. IEEE Distinguished Lecturer Program – by Chapter ii. High Temperature Superconductors Presentation – Mike Ross, AMSC iii. GPS Satellite & Navigation (DLP) – Dr. Eric Burt iv. Potential Presentations or Activities i. Medical Ultrasound Applications and FDA Regulations (DLP) – Dr. Keith Wear ii. Tours – Davis Besse, Neil Armstrong Test Facility, First Solar iii. AI Talk G. Roundtable Discussion a. Next ExCom meeting Tuesday, May 5, 2026, Byblos H. Adjournment Virtual: https://events.vtools.ieee.org/m/553271

The path from a novel technology concept to a commercialized medical device is rarely linear. Drawing on over 27 years of experience involving the development of volumetric x-ray computed tomography, photoacoustics, and thermoacoustic imaging, this talk explores critical stages and lessons learned in the entrepreneurial journey. We will move beyond the equations of inverse problems to discuss the "real-world" physics and engineering of an innovative company. Key topics will include: - Product Concept & Positioning: Identifying the clinical "pain point" and ensuring your technology—whether DEXA or thermoacoustics—is positioned to solve it effectively. - Building the Team: Transitioning from a technical founder to a technology leader and assembling the multidisciplinary expertise required for complex medical systems. - Commercialization & Exit: Lessons learned from the evolution of EVS Corp through its acquisition by GE Medical Systems and beyond. The session aims to provide engineers and aspiring entrepreneurs with a roadmap for translating technical innovation into impactful, market-ready healthcare solutions. Speaker(s): , Michael Thornton Virtual: https://events.vtools.ieee.org/m/551053

Abstract: Load growth is booming, and with that comes the increased need for power production infrastructure to support it. But what about the infrastructure that supports the current wave of new generation, particularly in the gas market? While there’s a heavy focus on increasing power production to support datacenters and other emergent load demand, the infrastructure to support new generation is an equally critical piece of the formula. And in order to secure their ability to produce power, many utilities are proactively investing in their gas supply infrastructure. This presentation takes a closer look at some critical electrical system design considerations for development of gas supply to new generation facilities, particularly design of critical long-lead components in an increasingly time-sensitive industry. Virtual Registration: Visit the (http://peschicago.org/) web site to register for the virtual session via Zoom. Click on "Calendar" in the green banner near the top of the (http://peschicago.org/) web page. In-Person Registration: Click on the "Register Now" button below. In-Person Registration Deadline: Monday, 6 April, 5 pm Central Agenda: Bio: Ryan Easterling has worked on a diverse portfolio of power generation projects during his career, including reciprocating internal combustion engine (RICE) generation facilities, simple- and combined-cycle gas turbine projects, coal/steam plant upgrades, and fossil power plant retirements. Most recently, Ryan has been supporting design and construction of liquefied natural gas (LNG) peak shaving facilities. He currently serves as the Electrical Department Manager for Burns & McDonnell’s Power Division in the Great Lakes Region. Ryan holds a Bachelors of Science in Electrical and Computer Engineering from Rose-Hulman Institute of Technology (’12) with a certificate in Power Systems and is a long-time member of both IEEE PES and IEEE IAS. In-Person Arrival Deadline: Wednesday, 8 April, 11:45 am Central In-Person Lunch Arrangements: Bring your lunch with you. Unfortunately, we aren't able to provide food for this event. Room: Suite 2700 (27th floor), Burns & McDonnell, 200 W Adams St, Chicago, Illinois, United States, 60606, Virtual: https://events.vtools.ieee.org/m/550604

Co-sponsored by: Aline Eid, Scott Lytle, Cody Trevillian, Looja Tuladhar, Sharan Kalwani Speaker(s): Michael, Agenda: Meet On-line at: Zoom meeting: https://umich.zoom.us/j/93435438729 Passcode: MIPSE **** OR **** Meet in-person at: The Michigan Institute for Plasma Science and Engineering 2236 EECS Bldg., 1301 Beal Avenue, Ann Arbor, Michigan 48109-2122, USA Wednesday, April 8, 2026 at 3:10 in room 1003 https://mipse.umich.edu/seminars_2526.php Phone: 734-647-0197 Email: [email protected] Room: 1003, Bldg: EECS Bldg, 1301 Beal Avenue, Ann Arbor, Michigan, Michigan, United States, 48109-2122, Virtual: https://events.vtools.ieee.org/m/541610

Attention robotics students! This April, don't forget to stop and smell the... lavender? The Intelligent Robotics and System Optimization Laboratory (IRoSOL) invites you to tour their workspace and learn about how mutliple-agent coordination can be used to harvest lavender in Michigan! Please arrive at R.L. Smith room 301 by 3pm for a 30 minute visit. To get involved with robotics at Michigan Tech, consider joining the IEEE Robotics and Automation Society Student Chapter. Use the QR code below to join the Michigan Tech IEEE discord to be informed of future events. Room: 301, Bldg: 20, 1400 Townsend Drive, Houghton, Michigan, United States, 49931

Come join the Madison Executive Committee for the April meeting. This is a great opportunity to get more involved with the IEEE at a local level, learn new things, make friends, and influence our activities. We will start off with social time and food (provided by the IEEE) from 5:30pm to 6pm. The meeting will be from 6pm to about 7:45pm. If you are planning to eat, please register with in person attendance. If you have any dietary restrictions or a specific order, please indicate when you register. This month we will be meeting on campus. If you have suggestions for agenda items this month please reply or send an email send an email to [email protected] Finalized agenda to be send before the meeting. Agenda: Agenda 5:30 - 6:00 pm - Social time and food 6:00pm - 7:30pm - Meeting Link to Agenda: https://docs.google.com/presentation/d/1n7-Z3t6f6qi74cVSUc542nElwjWGIk5W3vyfh-Iq_Ic/edit?usp=sharing Minutes from last meeting are here: https://docs.google.com/document/d/1Iw_YsEzlaG0LFji1PtkBTxgQiAwOHx4Y4buD8QMfgNo/edit?usp=sharing Room: Room 3609 , Bldg: UW Engineering Hall, 1415 Engineering Dr, Madison, Wisconsin, United States, 53706, Virtual: https://events.vtools.ieee.org/m/550160

The polymerase chain reaction (PCR) allows for sensitive detection of pathogens and genetic diseases. Early detection of diseases (e.g., influenza) is essential for timely and targeted treatment. A cost-effective PCR benefits society by providing access to fast and accurate diagnostics. However, paper-based PCR lacks the accuracy and reliability of traditional lab-based PCR, and microfabricated PCR devices face challenges with complex fabrication and high manufacturing costs. The PCR lab protocol includes a time-consuming gel electrophoresis step following PCR. Real-time PCR requires specialized, high-end equipment. To overcome these limitations, this research will focus on additive manufacturing and a smartphone-based microscope to develop a new PCR detection system. Additive manufacturing has shown promise in fabricating optical components, microfluidic devices, and microscopy components for biomedical engineering. Similarly, smartphones have been used in biological imaging to improve accessibility for point-of-care (POC) applications. These methods have been used separately or partially in PCR systems. 3D printing high-quality lenses and clear microchannels for PCR remains challenging, particularly for fluorescence capture. A portable, affordable, real-time microfluidic PCR (μPCR) system that maintains high accuracy and performance is a promising solution for rapid, sensitive diagnostics. The main objectives of this work are to address these challenges. Speaker(s): Park, Room: E101, Bldg: College of Engineering, Lawrence Technological University, 21000 West Ten Mile Road, Southfield, MI, 48075-1058, Southfield, Michigan, United States, 48075

Hello Everyone! Join us for our monthly virtual coffee hour. Bring your favorite brew and enjoy the stimulating conversation and company. We have had wide-ranging conversation covering AI, science fiction, comics, risks, and more. Share with us what interests you. Gary suggests that for the Mrach 13 discussion, we make the following one of the itmes: https://www.theguardian.com/technology/ng-interactive/2026/mar/12/lab-test-mounting-concern-over-rogue-ai-agents-artificial-intelligence https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=mf4c37374a5a74c2d1aef4254e159a027 Ahmed Naumaan - TC Section Chair Agenda: - Stimulating conversation We have had wide-ranging conversation covering AI, science fiction, comics, risks, and more. Share with us what interests you. Virtual: https://events.vtools.ieee.org/m/553438

Senior Dinner with Speakers Generously sponsored by the IEEE Education Society Co-sponsored by: IEEE Education Society GM 103, Milwaukee, Wisconsin, United States, 53202

The 2026 IEEE Nexus Region 4 Annual Student Leadership Conference (SLC) brings together student leaders, young professionals, and IEEE volunteers from across Region 4. The conference focuses on leadership development, professional growth, and technical inspiration. Participants will engage in workshops, panels, and networking with industry and IEEE leaders. SLC empowers students to build skills, connections, and vision for impactful careers and service. Registration covers Saturday, April 11, and includes breakfast, lunch, and evening snacks and an option Friday, April 10 networking reception. Limited number of student travel grants ($100) is available to IEEE student members. You can visit ieee.org/join to become eligible and register at the lower IEEE student member rate. The first 100 students will receive the travel grant which covers your registration fee and IEEE membership. [] Agenda: Bldg: Chicago-Kent College of Law, Illinois Technology Institute, 565 West Adams Street, Chicago, Illinois, United States, 60661

Register by March 31 for Early Bird pricing! [] The Children of the CornCon Kids' Hacker Camp Returns April 11, 2026! Age appropriate activities for kids from kindergarten through high school. Note that children must be accompanied by a guardian at all times. Registration opens at 8:30 am. Events from 9 am - 3:30 pm Regular pricing is $25 for the first student and $10 for additional students per guardian, including soldering kit, lunch, snacks, and beverages. We will have kids' t-shirts to give away from previous camps. Scholarships are available; contact [email protected] for details. (mailto:[email protected]) ([email protected]) if you would like to volunteer! Co-sponsored by: Eastern Iowa Community Colleges (EICC) and Docent Institute Agenda: Activities Include: - VR Tournament - Soldering - Capture the Flag Competition (Introductory and Intermediate) - Tearing apart and building a computer - Escape Room - Mad Science Activities - Electronic Graveyard - Coding Activities & Learn about AI - Lockpicking - Games and Puzzles Bldg: Scott Community College Urban Campus, 101 W 3rd St, Davenport, Iowa, United States, 52801

IEEE Southeast Michigan Young Professionals Affinity Group Admin Meeting - monthly Agenda: Agenda is emailed to team prior to meeting occurrence. Virtual: https://events.vtools.ieee.org/m/554410

[]Orbital angular momentum (OAM) technology has attracted much research interest in recent years because of its characteristic helical phase front twisting around the propagation axis and natural orthogonality among different OAM states to encode more degrees of freedom than classical planar beams. Based on these properties, OAM technique has been applied to wireless communication systems to enhance spectral efficiency and radar systems to distinguish spatial targets without beam scanning. To simultaneously harness the dual benefits of OAM in both communication and radar sensing, we propose an OAM-based millimeter-wave joint radar-communications (JRC) system comprising a bi-static automotive radar and vehicle-to-vehicle (V2V) communications. Different from existing uniform circular array (UCA) based OAM systems where each element is an isotropic antenna, an OAM spatial modulation scheme utilizing a uniform linear array (ULA) is adopted with each element being a traveling-wave antenna, producing multiple Laguerre-Gaussian (LG) vortex beams simultaneously. Specifically, we first build a novel bi-static automotive OAM-JRC model that embeds communication messages in a radar signal, following which a target position and velocity parameters estimation algorithm is designed with only radar frames. Then, an OAM-based mode-division multiplexing (MDM) strategy between radar and JRC frames is presented to ensure the JRC parameters identifiability and recovery. We end the talk with a future outlook on JRC systems. Speaker(s): Kumar Vijay Mishra Agenda: 6:00 pm - Introductions, 6:05 pm - Actual Talk 6:50 pm - Q&A, open discussion 7:00 pm - Formal thanks and event end Detroit, Michigan, United States, Virtual: https://events.vtools.ieee.org/m/553906

The presentation will include an overview of vehicle air brake systems used in North America, exploring their evolution, technical fundamentals, and the current state of the technology. Emerging trends will also be highlighted and include a discussion of next‑generation Electronic Braking Systems that are now arriving in the North American market. Speaker(s): Ryan Hurley Agenda: 5:30 Social 5:45 Dinner Buffet 6:30 Presentation Bldg: Beggar's Pizza, 1640 E. Summit Street, Crown Point, Illinois, United States, 46307

Come and support IEEE with bubble tea on Thursday, April 16th! Come stop by anytime between 2 - 7 PM at Gong Cha!! Bldg: Gong Cha, 641 E Grand River Ave, East Lansing, Michigan, United States, 48834

Dr. Ezzat will present his research group’s efforts to develop data-driven methods for forecasting electricity market signals and to further leverage them in informing wind energy operations. He will begin with a multivariate statistical approach for electricity price forecasting designed to capture the operational, economic, and temporal dependencies inherent in electricity price signals. The proposed approach is evaluated using two years of electricity price data from the California Independent System Operator, demonstrating significant improvements in both point and probabilistic forecast metrics relative to well-established statistical methods and emerging deep learning approaches. Independent validation against industry-adopted forecasting systems further demonstrates the method’s competitive performance and practical relevance. He will then turn to how variability in market signals, which is typically viewed as a challenge for power producers, can instead be transformed into an opportunity for improved decision-making. In particular, he will explore how grid-level information, such as electricity prices and curtailment, can create new operational opportunities for condition-based maintenance of wind turbine fleets. Taken together, these results highlight how market signals can be both accurately predicted and effectively utilized for wind energy operations, thereby bridging forecasting and optimization in renewable energy systems. Co-sponsored by: Wayne State University Room: Conference Room, Bldg: Manufacturing Engineering Building, Wayne State University Industry and Systems Engineering, 4815 4th Street, Detroit, Michigan, United States, 48202, Virtual: https://events.vtools.ieee.org/m/554374

Join other tech professionals and friends for our Tech Social every Third Friday. This is a monthly reoccurring networking/social meetup hosted by the IEEE R4 Iowa-Illinois Section and Computer Society Chapter. You don't need to be a Computer Society member or even an IEEE member to join us. Open to all engineers and technical professionals. [] Agenda: We plan to meet IN PERSON at Five Cities in Bettendorf. Five Cities Brewery , Bettendorf, Iowa, United States, 52722

We are hosting a young professionals social! Come join us for ax throwing and fun. As well as arcade games and food. We will meet at the entrance before going inside. We look forward to seeing you there. Please register so we know how many people to anticipate. If there are any questions, please email [email protected]. 27 9th St SE, Rochester, Minnesota, United States, 55904

Schools Day is Friday, April 17th from 9:00 AM – 2:00 PM and available to invited schools only. Teachers, for more information please visit the Schools Day tab above. Community Day is Saturday, April 18th from 9:00 AM – 2:00 PM. This is open to the public and people of all ages are welcome to attend our free event! For more information about community day or parking, click on the Attend tab above. Engineering EXPO! Explore the world of engineering through a free STEM outreach event interacting with student organizations, lab tours, hands-on activities, live demonstrations, keynote speakers in the field, and members from industry at Engineering EXPO. We are a completely student run organization, taking the whole school year to plan the details of this event. Our goal is to demonstrate the fascinating fields of science and inspire the future generations of engineers! EXPO will be held at the University of Wisconsin – Madison Engineering campus for two days (1415 Engineering Dr, Madison, WI 53706). Schools Day is Friday, April 17th from 9:00 AM – 2:00 PM and available to invited schools only. Teachers, for more information please visit the (https://engineeringexpo.wisc.edu/schools-2/) tab above. Community Day is Saturday, April 18th from 9:00 AM – 2:00 PM. This is open to the public and people of all ages are welcome to attend our free event! For more information about community day or parking, click on the (https://engineeringexpo.wisc.edu/publicity-2/)tab above. If you are an industry member interested in sponsoring, please visit the (https://engineeringexpo.wisc.edu/industry/) tab above. Most information about sponsorship and public donations can be found there. We can’t wait to see you on campus! Bldg: Engineering Hall, 1415 Engineering Dr, Madison, Wisconsin, United States

IEEE Central Indiana Section – SIGHT Workshop Empowering Humanitarian Technology Initiatives The IEEE Central Indiana Section invites members who are passionate about creating meaningful social impact through technology to participate in our upcoming SIGHT (Special Interest Group on Humanitarian Technology) Workshop. This interactive, action-oriented workshop is designed for members interested in initiating and contributing to humanitarian technology (HT) projects and in forming a SIGHT group within our Section. Together, we will build the foundation for a strong local community that will lead future HT initiatives and projects. Participants will: - Gain insights into IEEE SIGHT and the humanitarian technology ecosystem within IEEE - Learn how to identify, design, and implement impactful projects - Explore collaboration opportunities with fellow members and community partners - Actively contribute to the formation of the IEEE Central Indiana Section SIGHT Group Did you know? IEEE SIGHT membership is free for all IEEE members. You can join and learn more here: https://sight.ieee.org This workshop is intentionally limited in size to ensure a highly engaging and collaborative experience. Event Details: 📍 Location: Marriott Indianapolis North 📅 Date: Saturday, April 18 ⏰ Time: 13:00 – 15:30 👥 Capacity: Limited to 12 participants 📝 Registration Deadline: Friday, April 17, 6:00 PM via IEEE vTools We encourage interested members to register early and join us in shaping impactful humanitarian technology initiatives within our community. Interactive workshop—preparing for petitions and enabling action-oriented discussions so participants can actively engage Marriott Indianapolis North 3645 River Crossing Pkwy, Indianapolis, Indiana, United States, 46240

Bi-weekly administrative meeting for Vehicular Technology Society chapter (VT06) in Southeastern Michigan Section. Our OU # is CH04051. We invite all members of the VTS locally to participate and provide their input. Co-sponsored by: [email protected] Agenda: 09:00 PM - Meeting opens 0905 PM - Updates on topics from last meeting 0915 PM - New items from the attendess 0920PM - Wrap up and sharing notes 0930PM - Meeting ends ALL times are local EDT/EST! Virtual: https://events.vtools.ieee.org/m/554560

This event is being hosted by AI 2030 at Discovery Partners Institute. Please see https://luma.com/aehtah5h for details and registration. Room: 4th floor, Discovery Room, 200 S Wacker Dr., Chicago, Illinois, United States

SAE Chicago and IEEE VTS Chicago are pleased to work together with Argonne National Laboratory to provide this facility tour visit of Argonne National Laboratory, technical presentation and dinner. This special event will include guided tours of Argonne’s cutting-edge Transportation and Power Systems (TAPS) facilities, followed by a featured presentation from Dr. Byungho Lee, Director of Advanced Mobility and Charging Technologies (AMCT). Attendees will gain insights into Argonne’s pioneering work in vehicle systems, transportation electrification, energy efficiency, smart grid integration, and advanced mobility solutions. This is an excellent opportunity to network with industry professionals and explore the technologies shaping tomorrow’s transportation landscape. Catering & Networking Buffet Dinner will be provided at the Argonne Guest House. Please indicate any dietary restrictions during registration. A cash bar may be available (pending approval), allowing guests to purchase alcoholic beverages individually. Technical Presentation by Dr. Byungho Lee Topics include: - History of Argonne labs and facilities - Transportation and Power Systems (TPS) - Advanced Mobility and Charging Technologies (AMCT) - Current research initiatives and industry applications - Q&A *PDH Certificate will be available upon request Important Security Information All visitors must pass a security clearance to obtain an Argonne gate pass and attend this event. Link will be provided upon successful Eventbrite registration. US citizens will need to register by April 14th. Non-US citizens are required to apply by Thursday, March 26th as security clearance takes significantly longer. If we are not able to accommodate you for any reason, refunds will be provided. We look forward to seeing you for this unique opportunity to experience Argonne’s world-class research facilities firsthand. Please reach out with any questions. If you are unable to join us for the ANL facility tour due to work or personal commitments, we can still accommodate you for the dinner and technical presentation if interested. To register please visit https://www.eventbrite.com/e/argonne-national-laboratory-facility-tour-technical-presentation-tickets-1984936106327. IEEE VTS Chicago members can use IEEEVTSCHI to get a complimentary ticket. Only limited number of complimentary tickets are available. After registering for your ticket, please go to the Argonne visitor site to apply to get your pass to get into the facility: https://apps.anl.gov/registration/visitors/[email protected]&arrival=2026-04-22&departure=2026-04-22&vip_ticket_request_no=FMS0117226&event_ticket_request_no= Agenda: 03:30 PM - 04:00 PM Check-In at Security 04:00 PM - 05:30 PM Guided ANL TAPS Facility Tour 05:30 PM - 06:00 PM Doors Open at Argonne Guest House, Networking, Buffet Dinner 06:00 PM - 06:15 PM Welcome & Introductions - SAE Chicago & IEEE VTS Chicago 06:15 PM - 07:00 PM Featured Technical Presentation by Dr. Byungho Lee Dr. Byungho Lee 07:00 PM - 07:30 PM Q&A, Announcements, & Closing Remarks Bldg: Argonnen National Laboratory, 9700 South Cass Avenue, Lemont, Illinois, United States, 60439

Innovator’s Toolkit: Patents & IP 101 A Virtual Speaker Series Event Have a great idea—but not sure how to protect it? Curious about patents, intellectual property, and how engineers can turn innovation into impact? Join the IEEE Cedar Rapids Section WIE Affinity Group and IEEE Cedar Rapids Section for an engaging virtual session that breaks down the essentials of patents and IP in a practical, engineer-friendly way. Whether you’re an engineer, innovator, student, or tech professional, this session will give you a clear, practical foundation in patents and intellectual property—and the confidence to start building your own innovator’s toolkit. ✨ Registration is free—save your spot and bring your curiosity! Speaker(s): Moriah Bisewski Agenda: [] Virtual: https://events.vtools.ieee.org/m/553331

[] Electromagnetic scattering from natural surfaces and layered media plays a central role in microwave remote sensing of the Earth. Accurate interpretation of radar observations requires physically consistent modeling of rough-surface scattering from land and ocean and volumetric interactions within snowpacks. However, commonly used analytical and empirical models are often limited by simplifying assumptions that neglect multiple scattering and depolarization mechanisms, leading to discrepancies between modeled and observed radar signatures. This lecture investigates electromagnetic wave scattering from complex geophysical surfaces using a fast multilevel sparse-matrix canonical grid (FML-SMCG) method. FML-SMCG is developed to enable large-scale simulations of three-dimensional rough surfaces with large root-mean-square heights and slopes. The study examines scattering from fractal soil and ocean surfaces under extreme winds at L-band (1.26GHz), and rough surfaces at C- (5.5GHz), X- (9.6GHz) and Ku- (17.2GHz) bands. Further, volume scattering is studied within snowpacks using bi-continuous dense media radiative transfer (Bic-DMRT) to capture cross-polarized scattering from snow at C-, X- and Ku-bands. Building on these physical insights, a parameterized volume scattering model is developed for snow water equivalent retrieval using X- and Ku-band radar observations. The results provide improved understanding of depolarization mechanisms and support the development of more accurate remote sensing retrieval algorithms. Speaker(s): Firoz Borah, Room: 3316, Bldg: EECS, 130 Beal Ave, Ann Arbor, Michigan, United States, 48109-2122

Pizza Sponsor: (https://www.cornucopiatechnicalsales.com/) Venue Sponsor: (https://www.apextestlabs.com/) Kristof P. von Czarnowski Speaker Bio: Kristof P. von Czarnowski is an RF and hardware engineer specializing in high-frequency and mixed-signal system design for automotive applications. At Lear Corporation since 2022, he leads transceiver design, implementation, and validation, while also contributing to low- and high-voltage hardware platforms with a focus on signal integrity, power integrity, and electromagnetic susceptibility and emissions. He serves as an electromagnetic compatibility (EMC) simulation subject matter expert, working to shift EMC from reactive post-test mitigation to proactive design integration. His work aims to embed EMC constraints directly into the development process through design guidelines, automated design rule checks, simulation workflows, and libraries - pushing for earlier issue detection, reducing validation risk, and improving first-pass success rates across schematic design, PCB layout, and compliance validation. Kristof holds undergraduate and graduate degrees in engineering from Oakland University, where he specialized in electromagnetics and wireless systems. His technical interests include practical EMI/EMC simulation workflows, SI/PI co-design, and model validation for RF and power distribution networks. His recent work explores AI-assisted engineering tools and machine learning approaches to automate component characterization and accelerate system-level EMC prediction - ad dressing the industry's missing-model bottleneck that prevents full system-level compliance prediction. Abstract Every electromagnetic compatibility problem begins with Maxwell's equations. Yet the path from fundamental physics to actionable EMC prediction remains opaque to many practicing engineers. This presentation aims to demystify this journey. We start at the foundation: how Maxwell's equations in differential and integral form lead to fundamentally different numerical solver families - volume-based methods (FEM, FDTD) versus surface-based methods (MoM, PEEC). The choice is not arbitrary; it is dictated by your problem's physics, materials, and electrical size. Through practical examples, we demonstrate solver selection for automotive EMC: when to use full-wave 3D versus quasi-static extraction, how to bridge the MCAD/ECAD domain gap, and why near-field antenna geometry matters. A detailed biconical antenna walkthrough demonstrates the complete workflow - from geometry definition exploiting axial and planar symmetries, through material assignment strategies (PEC versus realistic copper), radiation boundary setup for CISPR 25 test distances, port excitation, and convergence. But an antenna model alone does not predict EMI. The critical step is integration: combining the biconical antenna with a device harness in a unified simulation domain to capture mutual coupling, then extracting S-parameters for the complete antenna-harness-LISN system. We demonstrate the EM-to-SPICE handoff - Touchstone curve-fitting with passivity and causality enforcement, integration with nonlinear sources, and time-domain-to-frequency-domain conversion for emission prediction. The practical bottleneck is not Maxwell's equations - the physics is solid. The challenge is missing component models when modeling your DUT (e.g., PCB with SMD components). Vendor libraries are incomplete or physically inconsistent (non-passive, non-causal), and measuring every passive on a real BOM is not scalable. We conclude with a physics-informed machine learning approach that synthesizes broadband capacitor models from part descriptions alone, achieving accuracy sufficient for design comparison without waiting for vendor data. Simulation does not replace measurement. But it enables the critical capability every EMC engineer needs: the ability to rank design alternatives before building hardware. Layout variant A versus B. Filter topology trade-offs. Shielding effectiveness. You don't need absolute dBμV accuracy to pick the better design - you need the ranking to be correct. And when combined with analytical design rule checking and validated component models, computational electromagnetics delivers that predictive capability early in the design cycle, where changes are inexpensive and design freedom is highest. Agenda: 5:30 Pizza and networking 6:00 Presentation 7:30 End Apex Test Labs, 815 N Opdyke Road, Auburn Hills, Michigan, United States, 48326

Boston Chapter of the IEEE Computer Society and GBC/ACM 7:00 PM, Thursday, 23 April 2026 MIT Room 32-G449 (Kiva) and online via Zoom Complexity of the Internet—An AI Observation Science Perspective Jeremy Kepner, MIT Please register in advance for this seminar even if you plan to attend in person at https://acm-org.zoom.us/webinar/register/6717750000324/WN_Z5KGSMQBSg2dzjM7s_X0mw After registering, you will receive a confirmation email containing information about joining the webinar.Indicate on the registration form if you plan to attend in person. This will help us determine whether the room is close to reaching capacity. We plan to serve light refreshments (probably pizza) before the talk starting at around 6:30 pm. Letting us know you will come in person will help us determine how much pizza to order. We may make some auxiliary material such as slides and access to the recording available after the seminar to people who have registered. Abstract: What does “normal” look like in a system that grows, adapts, and scales at extraordinary speed? How do its underlying patterns shift as the network expands from its early days to a billion-fold increase in scale? In this seminar, Dr. Kepner will explore how advances in high-performance, privacy-preserving AI graph analysis tools open new windows into the Internet’s behavior. His work sheds light on emergence, structure, and stability within this constantly changing global system. Dr. Kepner will explain the deep connections between graphs and matrices and more general mathematical concepts of semirings and associative (token) arrays that are the foundations of modern large language model (LLM) agentic AI systems. These mathematical concepts form the basis of the high performance GraphBLAS sparse matrix standard and the D4M (Dynamic Distributed Dimensional Model) associative array library that can analyze the largest networks in the world while preserving privacy. Bio: Dr. Jeremy Kepner is an MIT Lincoln Laboratory Fellow. He founded the Lincoln Laboratory Supercomputing Center and pioneered the establishment of the Massachusetts Green High Performance Computing Center. He has developed novel big data and parallel computing software used by thousands of scientists and engineers worldwide. He has led several embedded computing efforts, which earned him a 2011 R&D 100 Award. Kepner has chaired the SIAM Data Mining conference, the IEEE Big Data conference, and the IEEE High Performance Extreme Computing conference. Kepner is the author of two bestselling books, Parallel MATLAB for Multicore and Multinode Computers, and Graph Algorithms in the Language of Linear Algebra. His peer-reviewed publications include works on abstract algebra, astronomy, astrophysics, cloud computing, cybersecurity, data mining, databases, graph algorithms, health sciences, plasma physics, signal processing, and 3D visualization. In 2014, he received Lincoln Laboratory's Technical Excellence Award. You can learn more about his work here: https://www.mit.edu/~kepner/ Kepner holds a BA degree in astrophysics from Pomona College and a PhD degree in astrophysics from Princeton University. He is a fellow of the Society of Industrial Applied Mathematics (SIAM) and is a faculty advisor to the MIT SIAM student group. Directions to 32-G449 - MIT Stata Center, 32 Vassar Street, Cambridge, MA: Please use the main entrance to the Stata Center at 32 Vassar Street (the entrance closest to Main street) as those doors will be unlocked. Upon entering, proceed to the elevators which will be on the right after passing a large set of stairs and a MITAC kiosk. Take the elevator to the 4th floor and turn right, following the hall to an open area; 32-G449 will be on the left. (https://whereis.mit.edu/?go=32) This joint meeting of the Boston Chapter of the IEEE Computer Society and GBC/ACM will be hybrid (in person and online). Up-to-date information about this and other talks is available online at https://ewh.ieee.org/r1/boston/computer/. You can sign up to receive updated status information about this talk and informational emails about future talks at https://mailman.mit.edu/mailman/listinfo/ieee-cs, our self-administered mailing list. Co-sponsored by: gbc/acm Speaker(s): Jeremy Kepner, Room: 32-G449 (Kiva), Bldg: MIT building 32, 32 Vassar St, Cambridge, Massachusetts, United States, Virtual: https://events.vtools.ieee.org/m/533802

On April 24, 2026, the Living Earth Initiative, International Institute for BioSensing, Biomimetics International, IEEE Twin Cities Sensor Council Chapter brings together an extraordinary group of thinkers, builders, and changemakers to explore a different narrative—one rooted in hope, alignment, and action. From the Music of the Spheres to the Rhythm of Cities, from global citizen engagement to circular systems and digital water, this gathering is designed as a living symphony—where ideas don’t just resonate, they connect, flow, and evolve. Time Speaker Talk Title 10:00 - 11:00 Mei Lin Fung (Vice Chair of the UN AI for Good Impact Steering Committee and Co-Founder of the People-Centered Internet) The Music of the Spheres: Tuning Our Collective Heart Spark as Biosensors for Spaceship Earth 11:15 - 12:00 Michael Sheldrick (Chief Policy, Impact and Government Relations Officer at Global Citizen) The Global Chorus: Raising Voices for a Living Planet 12:00 - 13:00 Lunch Break 13:00 - 13:45 Robin Evans-Agnew, RN, PhD (Professor, UWT SNHCL) Singing in the rain: Nursing and just relations for the Rights of Water 13:45 - 14:30 Thomas Fisher (Director GeoCommunities, director of the Minnesota Design Center, and Dayton Hudson Chair in Urban Design in the College of Design at the University of Minnesota) The Rhythm of Cities 14:30 - 15:15 Michael Wright (CEO Biomimetics International) Digital Water the New Currents of Life 15:15 - 16:00 Björgvin Sævarsson (CEO Yorth Group) Orchestrating Circularity in the Real World: Infrastructure, Governance, and the Work of Coordination [] Co-sponsored by: International Institute for Biosensing, Biomimetics International Speaker(s): Mei Lin , Mike, Robin, Tom, Michael, BJ Virtual: https://events.vtools.ieee.org/m/551988

IEEE VTS Chicago members are invited to attend this guest lecture in Prof. Alvin Chin's causal inference class from Dr. Ishansh Gupta of BMW Group who will be talking about Causal Machine Learning in Automotive Supply Chain. Please connect with the Zoom link in the registration area. Speaker(s): Ishansh Gupta, Virtual: https://events.vtools.ieee.org/m/556439

J. Robert Oppenheimer was brilliant, arrogant, proud, charismatic — and a national hero. Under his leadership during World War II, the United States succeeded in becoming the first nation to harness the power of nuclear energy to create the ultimate weapon of mass destruction — the atomic bomb. But after the bomb brought the war to an end, in spite of his renown and his enormous achievement, America turned on him, humiliated him, and cast him aside. The question this film asks is, “Why?” AMERICAN EXPERIENCE presents The Trials of J. Robert Oppenheimer, featuring Academy Award-nominated actor David Strathairn (Good Night and Good Luck, The Bourne Ultimatum) as Robert Oppenheimer. From multiple Emmy Award-winning producer David Grubin (RFK, LBJ, Abraham and Mary Lincoln: A House Divided), The Trials of J. Robert Oppenheimer features interviews with the scientist’s former colleagues and eminent scholars to present a complex and revealing portrait of one of the most important and controversial scientists of the twentieth century. The two-hour film traces the course of Oppenheimer’s life: his rarefied childhood, his troubled adolescence, his emergence as one of America’s leading nuclear physicists, his leadership of the Los Alamos laboratory, and his tragic humiliation. { note: originally broadcast as part of American Experience , Running Time: 1 hr 45 min } AFTER the documentary - we can have a brief discussion session. NOTE: You must supply your own soda pop and popcorn! :-) Trivia may also follow, so bring your Jeopardy hats too! Agenda: 7:00 PM - Welcome and Introductions, Chapter business update; (on your own) Pizza, Popcorn and Soda Pop 7:05 PM - Documentary 8:45 PM - End of Documentary; Start of Q & A; Group Discussion 8:59 PM - Wrap Up ALL times are in EST/EDT (UTC-4 or UTC-5) depending upon local day light savings times in when effect Virtual: https://events.vtools.ieee.org/m/551376

In its Precision Sensing Lecture Series, International Institute for Biosensing (IIB) and Twin Cities IEEE Sensor Council Chapter is proud to host Prof. Christy Haynes, Department Head, Associate Director of the Center for Sustainable Nanotechnology, and an associate editor for the journal Analytical Chemistry. She is also a Distinguished McKnight University Professor, her research group works at the interface of analytical, biological, environmental, and nanomaterials chemistry. [] Co-sponsored by: International Institute for Biosensing Speaker(s): Christy Virtual: https://events.vtools.ieee.org/m/553316

Come join us for this speaker series with Dr. Brocker, where he will be speaking on Frequency Selective Surfaces! Speaker(s): Donovan Brocker, Room: S358, Bldg: MSOE Allen-Bradley Hall of Science, 432 E Kilbourn Ave, Milwaukee, WI 53202, Milwaukee, Wisconsin, United States

Tech is moving fast — and the best way to keep up is together. Join the ACM-IEEE WIE Twin Cities community for an evening of expert-led talks, lively debate, and genuine connection. This session is part of our ongoing Track 08 — Current: Signal Through the Noise series, designed to cut through the hype and get to what actually matters in tech today. On the agenda: a beginner-friendly deep dive into OpenClaw — one of the most talked-about open-source AI agent frameworks of 2026 — followed by a community roundtable on one of the hottest debates in AI right now: Open Source vs. Cloud AI — who really wins? Whether you're an engineer, researcher, student, or tech enthusiast, this is your space to learn, challenge ideas, and meet people building the future of tech. What's Happening - 👋 Welcome & Intro — ACM-IEEE Twin Cities by Lakshmi Priya Gopalsamy, Senior Engineering Manager-Target - 🎤 Introduction to OpenClaw — What It Is & How to Build Your First AI Agent? by Sowmya Podila, Senior AI Scientist-Target - 🎤 Community Roundtable: Open Source vs. Closed AI — Who Wins? Moderate by Sai Vineela Ganti, Senior Engineer -Target - 🤝 Networking & Community MixerI - If you would like to talk/present in upcoming sessions, please submit your topic (https://twincities-techhub.lovable.app/apply) Learn more about this group (https://twincities-techhub.lovable.app/) Join our LinkedIn Group (https://www.linkedin.com/groups/19247009/) Parking: The parking garage is located underground. The entrance is on 4th St. Pricing (if entering before 5pm): 0-1 hour - $4 1-2 hours - $5 2-3 hours - $6 3-4 hours - $9 In after 5pm and out by 10pm - $5 There are pay stations in the lobby as well as in the parking garage outside the elevators. The pay station in the lobby takes cash, the pay stations outside the elevators take credit cards. You’ll need to keep your parking ticket with you to the exit. There is some metered street parking on 3rd street. Navigation to the Doty Boardroom: For those using the parking garage, take the elevator up to the 2nd floor. Once exiting the elevator, take a left and then another left, and the boardroom will be on the right across from the art gallery. For those coming from outside, once you enter the lobby take the escalator up to the second floor. Walk across the bridge and the boardroom will be on the right across from the art gallery. Co-sponsored by: Association for Computing Machinery (ACM) Speaker(s): Sowmya Room: N-111, Bldg: Minneapolis Central Library, 300 Nicollet Mall, minneapolis, Minnesota, United States

AI is often describes as transforming productivity , it’s also redefining how communities connect, engage, and create impact. This session shows how to use AI to turn passive groups into activated ecosystems through personalized engagement, real-time knowledge access, and meaningful participation, brought to life through the journey of ASK (Actionable Support Knowledge). If you’re looking to build, grow, or energize a community that truly delivers value, this is your invitation to learn, collaborate, and be part of something bigger. About the speaker: Nita Ambedkar Founder of Source-Right, with 20+ yrs of building technology solutions, consulting. Source-Right focuses on building tech solutions in AI /IoT space, program management consulting and building teams for small medium scale businesses. Agenda: Explore use cases for AI for community building Demo ASK platform Behind the scene – learnings Room: 302, Bldg: Madison Central Library, 201 West Mifflin Street, Madison, Wisconsin, United States, 53703, Virtual: https://events.vtools.ieee.org/m/556736

IEEE Chicago and IEEE Computer Society Chicago are pleased to be partners for the Global Cybersecurity Initiative Conference here in Chicago that will be held at Illinois Institute of Technology Chicago Kent School of Law. IEEE Chicago members can get a discounted rate for the event using the code IEEE2026 by entering this in the website: https://gcsichicago.org/registration-for-annual-conference/ Agenda: April 30, 2026 Illinois Institute of Technology (565 West Adams Street, Chicago, IL 60661) The intersection of AI adoption and cyber readiness 8:30am Registration 8:45 – 9:00am Welcoming Remarks- 9:00 – 9:50 am Distinguished Speaker – 9:50 – 10:30 am CISO Panel Moderator: Bruce Coffing, CISO, City of Chicago Speakers: Fred Kwong, CISO, DeVry Ricardo Lafosse, CISO, The Kraft Heinz Company Sebastiaan Gybels, Sr VP, Northern Trust Rebecca Lively, Stealth Startup 10:30 – 10:45 am Networking Break 10:45 – 11:10 am Fireside Chat with on AI & Sustainability interviewer: Jason Czarnezki, Dean, Chicago-Kent College of Law 11:10 – 11:55 am CxO Panel – Securing supply chains amid opacity and concentration risks Moderator: Mark Rorabaugh, CEO, InfraShield Speakers: Stephen Reynolds, Attorney with McDermott, Will Terry Kurzynski, Chief Security Advisor, HALOCK Matt Hartzman, Advisor, Hartzman Partners Noon – 1:00 pm Networking Lunch 1:00 – 1:30 pm Fireside Chat – Nitin Raina, Global CISO at Thoughtworks Interviewer: Gregg Friedman, President, ISSA Chicago 1:30 – 2:00 pm Fireside Chat – David Neuman, Chief Operating Officer at acceligence Interviewer: Nicole Beebe, Dean, College of Computing, Illinois Tech 2:00 – 2:15 pm Networking Break 2:20 – 3:10 pm Board Level discussions – Elevating Cybersecurity as a Strategic Business Priority Moderator: Laszlo Gonc, Founder/CEO, Next Era Transformation Group) Speakers: Robert Barr, PDA Board member Bob Kress, Retired MD at The Accenture Security Wendy Betts, Information Security Officer, Rotary International 3:10 – 3:25 pm Networking Break 3:25 – 4:05 pm Panel on Cybersecurity for highly regulated areas Healthcare, Fintech and Insurance Moderator: Richard Warner, Chicago-Kent College of Law Speakers: Mahmood Khan, CISO, CNA Karen Habercross, Vice President, Chief Information Security and Privacy Officer 4:05 – 4:45 pm Distinguished Speaker – Evan Pena, Founder, Armadin 4:45-5:00 pm Closing Remarks – Kasi Paturi, President, PAABC 5:00-6:00 pm Networking Bldg: IIT Chicago Kent School of Law, 565 West Adams Street, Chicago, Illinois, United States, 60661

The IEEE Region 4 Young Professionals Mentoring-Meet Event connects young professionals with experienced IEEE professionals who serve as mentors to support career development, support skill-building, and provide industry insight. Participants will engage in one-on-one mentoring sessions. Agenda: 7:00 PM — Welcome & Opening Remarks 7:10 PM — Breakout Rooms Open (one-on-one mentoring session) 8:10 PM — Return to Main Room / Open Networking 8:12 PM — Closing Remarks 8:15 PM — End Virtual: https://events.vtools.ieee.org/m/544997

[]This presentation provides a high-level description of CALCE-UMD activities in reliability physics of microelectronic systems, starting with a brief history and continuing on to recent trends in multiscale modeling of the reliability of advanced microelectronic packaging. The discussion includes specific focus on the importance of considering material microstructure in predictive reliability physics modeling; and explores the role of reliability physics in the context of AI/ML* approaches for reliability modeling. In Topic 1, we will examine three examples where microstructure-sensitive modeling can provide important insights into material behavior: (i) organic interposers/substrates that are based on fabric-reinforced composites; (ii) solder alloys with heterogeneous multiscale microstructure; (iii) sintered silver materials with agglomerated nanoporous microstructure. In Topic 2, we will qualitatively explore the interplay between reliability physics and AI/ML in influencing both epistemic as well as aleatory uncertainties in reliability predictions. *AI/ML: Artificial Intelligence / Machine Learning Speaker(s): Abhijit Dasgupta, Bldg: ARMS 3115, Purdue University, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/554090

This presentation summarizes an integrated workflow to quantify and model how real char particle morphology influences gas–solid multiphase transport, with a focus on improving the fidelity of reactor- scale simulations for biomass–coal conversion systems. Char particles produced from bituminous coal and biomass (pine sawdust) are imaged using high-resolution micro-CT, and their 3D geometries are reconstructed in ScanIP for particle-scale analysis. Using these realistic morphologies, particle-scale CFD simulations resolve coupled conservation equations (mass, momentum, species, and energy) under combustion-relevant boundary conditions, enabling direct evaluation of morphology-driven flow and thermal fields and their impact on aerodynamic drag. The study further assesses the accuracy of classical drag correlations developed for idealized shapes by comparing them against 3D simulation results across multiple particle orientations and Reynolds numbers (Re = 20–200), highlighting substantial model discrepancies when irregularity and orientation effects are present. Unlike the conventional models, to consider the full picture of the particle morphology and reduce the computational burden of high-fidelity CFD, a deep-learning algorithm has been developed in which a CNN ingests voxelized 3D particle images along with Reynolds number/orientation encoding to predict drag coefficients, achieving high accuracy and enabling rapid parameter sweeps that are impractical with CFD alone. Speaker(s): Dr. Dongyu Liang, Room: E101, Bldg: Engineering Building, southfield, Michigan, United States, 48075

Join us for an exciting technical talk organized by IEEE LTU Student Branch. Speaker(s): SREEDHAR BABU SESHAGANI, Virtual: https://events.vtools.ieee.org/m/557408

AI or Not AI in Clinical Settings: Trust, Risk, and Accountability in AI-Driven Medical Documentation Co-sponsored by: Ahmed Abdelgawad Courtyard Mt. Pleasant at Central Michigan University, Mt Pleasant, Michigan, United States, 48858-4499

Blockchain and IoT Applications Co-sponsored by: Ahmed Abdelgawad Central Michigan University ET132, Mt Pleasant, Michigan, United States, 48859